Display device having a sensor area

ABSTRACT

A display device includes a display panel including a main area and a sensor area. Sensor devices overlap the sensor area of the display panel in a thickness direction of the display panel. The display panel includes first subpixels, which are disposed in the sensor area, and second subpixels, which are disposed in the main area. The number of transistors of each of the first subpixels is different from the number of transistors of each of the second subpixels.

This application claims priority under 35 U.S.C § 119 to Korean PatentApplication No. 10-2019-0088340, filed on Jul. 22, 2019, in the KoreanIntellectual Property Office (KIPO), the disclosure of which isincorporated by reference herein in its entirety.

TECHNICAL FIELD

The present disclosure relates to a display device and, morespecifically, to a display device having a sensor area.

DISCUSSION OF THE RELATED ART

Display devices are becoming more widely available in a great variety ofdifferent forms. For example, display devices have been adapted for usein a variety of electronic devices such as a smartphones, a digitalcameras, notebook/laptop computers, navigation devices, smart andtraditional televisions (TV), and the like. A typical display device mayinclude a display panel, which includes a plurality of pixels connectedto scan lines, data lines, and power supply lines for displaying animage. Display devices may further include various sensor devices suchas a proximity sensor for detecting the presence of a user nearby, anillumination sensor for detecting luminance, and an iris sensor forrecognizing the user's iris. The sensor devices may be disposed in holesthat are provided at the front of the display device so as not tooverlap with the display panel.

Meanwhile, as the types and functions of display devices hasdiversified, the demand for display devices in various designs hasincreased. For a smartphone, for example, a display device may have ahole or notch within the display area for accommodating the varioussensor devices so that the sensor devices do not need to be disposed ona periphery of the display area, thereby providing a widened displayarea. Some other display devices may avoid the need for holes andnotches by disposing the sensors to at least partially overlap with thedisplay area. However, if the sensor devices are disposed to at leastpartially overlap with the display panel, the sensing capabilities ofthe sensor devices may be degraded because the sensor devices are hiddenby pixels, scan lines, data lines, and power supply lines of the displaypanel.

SUMMARY

A display device includes a display panel including a main area and asensor area. A plurality of sensor devices at least partially overlapthe sensor area of the display panel in a thickness direction of thedisplay panel. The display panel includes first subpixels, which aredisposed in the sensor area, and second subpixels, which are disposed inthe main area, and the number of transistors of each of the firstsubpixels is different from the number of transistors of each of thesecond subpixels.

The number of transistors of each of the first subpixels may be smallerthan the number of transistors of each of the second subpixels.

The display panel may further include scan lines, data lines, andemission lines. The first subpixels and the second subpixels each mayinclude a driving transistor, which controls a driving current thatflows from a first electrode to a second electrode of the drivingtransistor, in accordance with a data voltage applied to a gateelectrode of the driving current. A light-emitting element is connectedto the second electrode of the driving transistor. A first transistor isturned on by a scan signal from one of the scan lines to connect thegate electrode of the driving transistor and an initialization voltageline to which an initialization voltage is applied. A second transistoris turned on by a scan signal from another one of the scan lines toconnect the first electrode of the driving transistor and one of thedata lines. A third transistor is turned on by a scan signal from yetanother one of the scan lines to connect the first and second electrodesof the driving transistor. A fourth transistor is turned on by anemission signal from one of the emission signals to connect the firstelectrode of the driving transistor and a first driving voltage line towhich a first driving voltage is applied. A fifth transistor is turnedon by an emission signal from another one of the emission lines toconnect the second electrode of the driving transistor and thelight-emitting element.

Each of the second subpixels may further include a sixth transistorwhich is turned on by a scan signal from yet still another one of thescan lines to connect a first electrode of the light-emitting elementand the initialization voltage line.

The display panel may further include scan lines which at leastpartially overlap the first subpixels and the second subpixels and towhich scan signals are applied. The number of scan lines at leastpartially overlapping with each of the first subpixels may be differentfrom the number of scan lines at least partially overlapping with eachof the second subpixels.

The number of scan lines at least partially overlapping with each of thefirst subpixels may be smaller than the number of scan lines at leastpartially overlapping with each of the second subpixels.

The display panel may further include a light-transmitting area which isdisposed in the sensor area and does not overlap with the firstsubpixels.

The light-transmitting area may be at least partially surrounded by thefirst subpixels.

The display panel may further include a first scan connecting line whichis connected to one of the scan lines in a wiring area between thelight-transmitting area and the first subpixels and is disposed in adifferent layer from the scan lines.

The display panel may further include an insulating film which isdisposed between the first scan connecting line and the scan line towhich the first scan connecting line is connected. The first scanconnecting line may be connected to the scan line that it is connectedwith, through a contact hole which penetrates the insulating film.

The display panel may further include initialization voltage lines whichat least partially overlap with the first subpixels and the secondsubpixels and to which initialization voltages are applied, data lineswhich at least partially overlap with the first subpixels and the secondsubpixels and to which data voltages are applied, and first drivingvoltage lines which at least partially overlap with the first subpixelsand the second subpixels and to which first driving voltages areapplied.

The display panel may further include a power supply connecting linewhich is connected to one of the first driving voltage lines in thewiring area and is disposed in a different layer from the first drivingvoltage lines.

One of the data lines may at least partially overlap with one of theinitialization voltage lines or the first scan connecting line in thewiring area.

The power supply connecting line may at least partially overlap with oneof the scan lines.

The display panel may further include an insulating film which isdisposed between the power supply connecting line and one of the firstdriving voltage lines. The power supply connecting line may be connectedto the first driving voltage line that it is connected, through acontact hole which penetrates the insulating film.

The power supply connecting line may be disposed on the data lines andon the first driving voltage lines. The data lines and the first drivingvoltage lines may be disposed between the initialization voltage linesand the first scan connecting line. The initialization voltage lines andthe first scan connecting line may be disposed on the scan lines.

The display panel may further include an initialization connecting linewhich is connected to one of the initialization voltage lines and may bedisposed in a different layer from the initialization voltage lines.

One of the data lines may at least partially overlap with theinitialization connecting line or the first scan connecting line in thewiring area.

The display panel may further include an insulating film which isdisposed between the initialization connecting line and one of theinitialization voltage lines. The initialization connecting line may beconnected to the initialization voltage line that it is connected,through a contact hole which penetrates the insulating film.

The power supply connecting line may be disposed on the data lines andon the first driving voltage lines. The data lines and the first drivingvoltage lines may be disposed on the scan lines. The scan lines may bedisposed on the initialization connecting line and on the first scanconnecting line.

The display panel may further include a second scan connecting linewhich is connected to another one of the scan lines and is disposed in adifferent layer from the scan lines, emission lines which at leastpartially overlap with the first subpixels and the second subpixels andto which emission signals are applied. An emission connecting line isconnected to one of the emission lines and is disposed in a differentlayer from the emission lines.

In the wiring area, one of the data lines may at least partially overlapwith the second scan connecting line, and another one of the data linesmay at least partially overlap with the emission connecting line.

The second scan connecting line and the emission connecting line may bedisposed in the same layer.

The power supply connecting line may be disposed on the data lines andon the first driving voltage lines. The data lines and the first drivingvoltage lines may be disposed on the initialization voltage lines andthe first scan connecting line. The initialization voltage lines and thefirst scan connecting line may be disposed on the scan lines and on theemission lines. The scan lines and the emission lines may be disposed onthe second scan connecting line and on the emission connecting line.

The display panel may further include a voltage connecting line which isconnected to the first driving voltage lines.

The first driving voltage lines may extend primarily in a firstdirection. The voltage connecting line may extend primarily in a seconddirection.

The voltage connecting line may be disposed on the first driving voltagelines.

The first driving voltage lines may be disposed on the voltageconnecting line.

The voltage connecting line may be disposed in the same layer as theinitialization voltage lines and may be disposed on the scan lines.

The initialization voltage lines may be disposed on the voltageconnecting line and may be disposed in the same layer as the scan lines.

The first driving voltage lines may be disposed in the same layer as thevoltage connecting line.

A display device includes a display panel including a main area and asensor area. Sensor devices at least partially overlap with the sensorarea of the display panel in a thickness direction of the display panel.The display panel includes first subpixels which are disposed in thesensor area. Second subpixels are disposed in the main area. Firstdriving voltage lines at least partially overlap with the firstsubpixels and the second subpixels to which first driving voltages areapplied. A power supply connecting line is connected to the firstdriving voltage lines and is disposed in a different layer from thefirst driving voltage lines.

A display device includes a light-transmitting area. A plurality ofsubpixels at least partially surrounds the light-transmitting area.First conductive lines are connected to the subpixels. Second conductivelines are connected to the first conductive lines in a wiring areabetween the light-transmitting area and the subpixels. The firstconductive lines are disposed in a different layer from the secondconductive lines.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure will become moreapparent by describing in detail exemplary embodiments thereof withreference to the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a display device according toan exemplary embodiment of the present disclosure;

FIG. 2 is an exploded perspective view illustrating the display deviceof FIG. 1;

FIG. 3 is a plan view illustrating a display panel of the display deviceof FIG. 1;

FIG. 4 is a block diagram illustrating the display panel and a displaydriving circuit of the display device of FIG. 1;

FIG. 5 is a plan view illustrating first subpixels, scan lines, datalines, and first driving voltage lines in a sensor area of the displaydevice of FIG. 1;

FIG. 6 is a plan view illustrating second subpixels, scan lines, datalines, and first driving voltage lines in a main area of the displaydevice of FIG. 1;

FIG. 7 is a circuit diagram illustrating an exemplary first subpixel;

FIG. 8 is a circuit diagram illustrating an exemplary second subpixel;

FIG. 9 is a plan view illustrating the first subpixel of FIG. 7;

FIG. 10 is a plan view illustrating the second subpixel of FIG. 8;

FIG. 11 is a cross-sectional view taken along line I-I′ of FIGS. 9 and10;

FIG. 12 is a cross-sectional view taken along line I-II′ of FIG. 9;

FIG. 13 is a cross-sectional view taken along line III-III′ of FIG. 10;

FIG. 14 is a plan view illustrating an area A of FIG. 5;

FIG. 15 is a cross-sectional view taken along line IV-IV′ of FIG. 14;

FIG. 16 is a plan view illustrating the area A of FIG. 5;

FIG. 17 is a cross-sectional view taken along line VIII-VIII′ of FIG.16;

FIG. 18 is a plan view illustrating the area A of FIG. 5;

FIG. 19 is a cross-sectional view taken along line V-V′ of FIG. 18;

FIG. 20 is a plan view illustrating the area A of FIG. 5;

FIG. 21 is a cross-sectional view taken along line VI-VI′ of FIG. 20;

FIG. 22 is a plan view illustrating pixels, the scan lines, the datalines, and the first driving voltage lines in the sensor area of thedisplay device of FIG. 1;

FIG. 23 is a plan view illustrating an area B of FIG. 22; and

FIG. 24 is a cross-sectional view taken along line VII-VII′ of FIG. 23.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will now be describedmore fully hereinafter with reference to the accompanying drawings. Thepresent invention may, however, be embodied in different forms andshould not be construed as limited exclusively to the exemplaryembodiments set forth herein. The same reference numbers may indicatethe same or corresponding components throughout the specification anddrawings, and thus to the extent that a description of an element may beomitted, it may be assumed that the element is at least similar tocorresponding elements that are described elsewhere in thespecification. In the attached figures, the size and the thickness oflayers and regions may be exaggerated for clarity. Thus, while therelative sizes and thicknesses of layers and regions in the drawings maybe illustrative of a particular embodiment, these elements may also beexaggerated for clarity.

It will also be understood that when a layer or element is referred toas being “on” another layer or element, the element or layer can bedirectly on the other layer or element, or intervening layers orelements may be present.

Hereinafter, exemplary embodiments of the present invention will bedescribed with reference to the attached drawings.

FIG. 1 is a perspective view illustrating a display device according toan exemplary embodiment of the present disclosure.

Referring to FIGS. 1 and 2, a display device 10 includes a cover window100, a display panel 300, a display circuit board 310, a display drivingcircuit 320, a flexible film 390, a bracket 600, a main circuit board700, sensor devices (740, 750, 760, and 770), and a lower cover/housing900.

The terms “above”, “top”, and “top surface”, as used herein, denote adirection in which the cover window 100 is disposed with respect to thedisplay panel 300, i.e., a Z-axis direction. The terms “below”,“bottom”, and “bottom surface”, as used herein, denote a direction inwhich the bracket 600 is disposed with respect to the display panel 300,i.e., the opposite direction of the Z-axis direction. Also, the terms“left”, “right”, “upper”, and “lower”, as used herein, denote directionsas viewed from above the display panel 300. For example, the term “left”denotes the opposite direction of an X-axis direction, the term “right”denotes the X-axis direction, the term “upper” denotes the Z-axisdirection, and the term “lower” denotes the opposite direction of theZ-axis direction.

The display device 10, which is a device for displaying a moving imageor a still image, may be used, not only in a portable electronic devicesuch as a mobile phone, a smartphone, a tablet personal computer (PC), asmart watch, a watch phone, a mobile communication terminal, anelectronic notebook, an electronic book, a portable multimedia player(PMP), a navigation device, or an ultra-mobile PC (UMPC), but also invarious other products such as a television (TV), a notebook/laptopcomputer, a computer monitor, an electronic billboard, or anInternet-of-Things (IoT) device.

The display device 10 may have a substantially rectangular shape in aplan view. For example, as illustrated in FIGS. 1 and 2, the displaydevice 10 may have a substantially rectangular shape having a pair ofshort sides extending primarily in a first direction (e.g. the X-axisdirection) and a pair of long sides extending primarily in a seconddirection (e.g. the Y-axis direction). The corners where the short sidesand the long sides of the display device 10 meet may be rounded to havea predetermined curvature (so as to form a rounded rectangle) or may beright-angled (so as to form a proper rectangle). The shape of thedisplay device 10 is not particularly limited, and the display device 10may be formed in various other polygonal shapes or in a circular orelliptical shape.

The display device 10 may include a first region DR1, which is formed tobe flat, and second regions DR2, which may have two sections, whichextend from the left and right sides of the first region DR1. The secondregions DR2 may be flat or curved down the Z-axis. In a case where thesecond regions DR2 are flat, the angle that the first region DR1 and thesecond regions DR2 form may be an obtuse angle. In a case where thesecond regions DR2 are curved, the second regions DR2 may have a uniformor variable curvature.

FIG. 1 illustrates that the second regions DR2 extend from the left andright sides of the first region DR1, but the present disclosure is notlimited thereto. Alternatively, the second regions DR2 may extend fromonly one of the left and right sides of the first region DR1. Yetalternatively, the second regions DR2 may extend not only from the leftand right sides, but also from the upper and lower sides, of the firstregion DR1. For convenience, the second regions DR2 will hereinafter bedescribed as being disposed on the left and right sides of the displaydevice 10.

The cover window 100 may be disposed on the display panel 300 to coverthe top surface of the display panel 300. Accordingly, the cover window100 may protect the top surface of the display panel 300 from impact andcontamination.

The cover window 100 may be disposed in the first region DR1 and in thesecond regions DR2. The cover window 100 may include first and secondlight-transmitting areas DA100 and SDA100, which correspond to thedisplay panel 300, and a light-blocking area NDA100 which corresponds toan area other than the display panel 300. The second light-transmittingarea SDA100 may be disposed on one side of the first light-transmittingarea DA100, for example, on the upper side of the firstlight-transmitting area DA100, as illustrated in FIGS. 1 and 2. Thefirst and second light-transmitting areas DA100 and SDA100 may bedisposed in the first region DR1 and in the second regions DR2. Thelight-transmitting area NDA100 may be opaque. The light-blocking areaNDA100 may be a decorative layer that can be seen by a user when noimage is displayed.

The display panel 300 may be disposed below the cover window 100. Thedisplay panel 300 may be disposed in both the first region DR1 and inthe second regions DR2. Accordingly, an image displayed by the displaypanel 300 can be seen not only in the first region DR1, but also in thesecond regions DR2. For example, an image displayed by the display panel300 can be seen not only on the top surface, but also on the left andright edges, of the display device 10 through the cover window 100.

The display panel 300 may include a main area MDA and a sensor area SDA.The main area MDA may be disposed to at least partially overlap with thefirst light-transmitting area DA100 of the cover window 100. The sensorarea SDA may be disposed to at least partially overlap with the secondlight-transmitting area SDA100 of the cover window 100. The sensor areaSDA may be disposed on one side of the main area MDA, e.g., on the upperside of the main area MDA, as illustrated in FIG. 2, but the presentdisclosure is not limited thereto. For example, the sensor area SDA maybe disposed adjacent to corners of the display panel 300 to be at leastpartially surrounded by the main area MDA. FIG. 2 illustrates that thedisplay panel 300 includes a single sensor area SDA, but the presentdisclosure is not limited thereto. Alternatively, the display panel 300may include multiple sensor areas SDA.

The display panel 300 may be a light-emitting display panel includinglight-emitting elements. For example, the display panel 300 may be anorganic light-emitting diode (OLED) display panel using OLEDs, amicro-light-emitting diode (mLED) display panel using mLEDs, aquantum-dot light-emitting diode (QLED) display panel using QLEDs, or aninorganic light-emitting diode (ILED) display panel including aninorganic semiconductor. The display panel 300 will hereinafter bedescribed as being an OLED display panel.

The display circuit board 310 and the display driving circuit 320 mayeach be attached to one side of the display panel 300. One end of thedisplay circuit board 310 may be attached, via an anisotropic conductivefilm (ACF), for example, on pads provided on one side of the displaypanel 300. The display circuit board 310 may be a flexible printedcircuit board (FPCB), a rigid printed circuit board (PCB), or a hybridPCB (e.g. partly flexible and partly rigid).

The display driving circuit 320 receives control signals and powersupply voltages via the display circuit board 310 and generates andoutputs signals and voltages for driving the display panel 300. Thedisplay driving circuit 320 may be an integrated circuit (IC) and may beattached on the display panel 300 in a chip-on-glass (COG) orchip-on-plastic (COP) manner or through ultrasonic bonding, but thepresent disclosure is not limited thereto. The display driving circuit320 may be attached on the display circuit board 310.

A touch driving circuit 330 may be disposed on the display circuit board310. The touch driving circuit 330 may be an IC and may be attached onthe top surface of the display circuit board 310. The touch drivingcircuit 330 may be electrically connected to touch electrodes of a touchsensor layer of the display panel 300 via the display circuit board 310.The touch driving circuit 330 may output touch data, which includes thecoordinates of touch input from the user, by applying touch drivingsignals to some of the touch electrodes of the touch sensor layer, e.g.,driving electrodes, and detecting charge variations in the capacitancesbetween the driving electrodes and the other touch electrodes of thetouch sensor layer, e.g., sensing electrodes, with the use of thesensing electrodes. A power supply unit 340 of FIG. 3, which is forproviding display driving voltages for driving the display drivingcircuit 320, may be additionally disposed on the display circuit board310.

One side of the flexible film 390 may be attached on the top surface ofthe display panel 300, from below the display panel 300, via an ACF. Theother side of the flexible film 390 may be attached on the top surfaceof the display circuit board 310, from above the display circuit board310, via an ACF. The flexible film 390 may be bendable or foldable.

The flexible film 390 might not be provided, and the display circuitboard 310 may be attached directly to one side of the display panel 300.In this case, one side of the display panel 300 may be bent toward thebottom surface of the display panel 300.

The bracket 600 may be disposed below the display panel 300. The bracket600 may include plastic, a metal, or both. A first camera hole CMH1 inwhich a first camera sensor 720 is inserted, a cable hole CAH that acable 314 connected to the display circuit board 310 passes through, andsensor holes SH in which the sensor devices (740, 750, 760, and 770) areeach disposed and may each be formed in the bracket 600. Alternatively,the bracket 600 might not include the sensor holes 600 and may be formedso as not to overlap with the sensor area SDA of the display panel 300.

The main circuit board 700 and a battery 790 may each be disposed belowthe bracket 600. The main circuit board 700 may be a PCB or an FPCB.

The main circuit board 700 may include a main processor 710, the firstcamera sensor 720, a main connector 730, and the sensor devices (740,750, 760, and 770). The first camera sensor 720 may be disposed on boththe top and bottom surfaces of the main circuit board 700, the mainprocessor 710 may be disposed on the top surface of the main circuitboard 700, and the main connector 730 may be disposed on the bottomsurface of the main circuit board 700. The sensor devices (740, 750,760, and 770) may each be disposed on the top surface of the maincircuit board 700.

The main processor 710 may control various functions of the displaydevice 10. For example, the main processor 710 may output digital videodata to the display driving circuit 320 via the display circuit board310 so that the display panel 300 can display an image. Also, the mainprocessor 710 may receive touch data from the touch driving circuit 330,may determine the coordinates of touch input from the user, and mayexecute an application pointed to by an icon displayed at thecoordinates of the touch input.

The main processor 710 may control the display device 10 in accordancewith sensor signals received from the sensor devices (740, 750, 760, and770). For example, the main processor 710 may determine whether there isan object in the proximity of the top surface of the display device 10using a proximity sensor signal received from a proximity sensor 740. Ina call mode when the user engages in a call with the use of the displaydevice 10, the main processor 710 might not execute an applicationpointed to by the coordinates of touch input from the user if there isan object in the proximity of the top surface of the display device 10.

The main processor 710 may determine the brightness at the top surfaceof the display device 10 in accordance with an illumination sensorsignal received from an illumination sensor 750. The main processor 710may control the luminance of an image displayed by the display panel 10based on the brightness detected at the top surface of the displaydevice 10.

The main processor 710 may determine whether an iris image from the useris the same as an iris image previously stored in a memory, inaccordance with an iris sensor signal received from an iris sensor 760.If the iris image from the user is the same as the iris image previouslystored in the memory, the main processor 710 may unlock the displaydevice 10 and may display a home screen on the display panel 300.

The first camera sensor 720 may process a still or moving image obtainedby an image sensor and may output the processed image to the mainprocessor 710. The first camera sensor 720 may be a complementarymetal-oxide-semiconductor (CMOS) image sensor or a charge-coupled device(CCD) image sensor. Since the first camera sensor 720 is exposed at thebottom surface of the lower cover 900 through a second camera hole CMH2,the first camera sensor 720 can capture an image of an object or a sceneat the bottom of the display device 10.

The cable 314, which passes through the cable hole CAH of the bracket600, may be connected to the main connector 730. As a result, the maincircuit board 700 may be electrically connected to the display circuitboard 310.

The sensor devices (740, 750, 760, and 770) may include the proximitysensor 740, the illumination sensor 750, the iris sensor 760, and asecond camera sensor 770. However, other types of sensor devices may beused.

The proximity sensor 740 is a sensor for determining whether there is anobject in the proximity of the top surface of the display device 10. Theproximity sensor 740 may include a light source which outputs light anda light receiver which receives light reflected from an object. Theproximity sensor 740 may determine whether there is an object in theproximity of the top surface of the display device 10 based on theamount of light reflected from the object. Since the proximity sensor740 is disposed to at least partially overlap with the sensor holes SH,the sensor area SDA of the display panel 300, and the secondlight-transmitting area SDA100 of the cover window 100 in the thicknessdirection of the display panel 300 (e.g. the Z-axis direction), theproximity sensor 740 may generate a proximity sensor signal inaccordance with the presence of an object in the proximity of the topsurface of the display device 10 and may output the proximity sensorsignal to the main processor 710.

The illumination sensor 750 is a sensor for detecting the brightness atthe top surface of the display device 10. The illumination sensor 750may include a resistor whose resistance varies in accordance with thebrightness of incident light. The illumination sensor 750 may determinethe brightness at the top surface of the display device 10 based on avariation in the resistance of the resistor caused by the brightness ofthe incident light. Since the illumination sensor 750 is disposed to atleast partially overlap with the sensor holes SH, the sensor area SDA ofthe display panel 300, and the second light-transmitting area SDA100 ofthe cover window 100 in the thickness direction of the display panel 300(e.g. the Z-axis direction), the illumination sensor 750 may generate anillumination sensor signal in accordance with the brightness at the topsurface of the display device 10 and may output the illumination sensorsignal to the main processor 710.

The iris sensor 760 is a sensor for determining whether an image of theuser's iris is the same as the iris image previously stored in thememory. The iris sensor 760 may generate an iris sensor signal inaccordance with whether the image of the user's iris is the same as theiris image previously stored in the memory, and may output the irissensor signal to the main processor 710.

The second camera sensor 770 may process a still or moving imageobtained by an image sensor and may output the processed image to themain processor 710. The second camera sensor 770 may be a CMOS imagesensor or a CCD image sensor. The number of pixels of the first camerasensor 770 may be smaller than the number of pixels of the first camerasensor 720, and the size of the second camera sensor 770 may be smallerthan the size of the first camera sensor 720. Since the second camerasensor 770 is disposed to at least partially overlap with the sensorholes SH, the sensor area SDA of the display panel 300, and the secondlight-transmitting area SDA100 of the cover window 100 in the thicknessdirection of the display panel 300 (e.g. the Z-axis direction), thesecond camera sensor 770 can capture an image of an object or thebackground at the top of the display device 10.

The battery 790 may be disposed so as not to overlap with the maincircuit board 700 in the third direction (e.g. the Z-axis direction).The battery 790 may at least partially overlap with a battery hole BH ofthe bracket 600.

A mobile communication module, which can exchange wireless signals witha base station, an external terminal, and/or a server, via a mobilecommunication network, may be further provided on the main circuit board700. The wireless signals may include various types of data associatedwith the transmission/reception of audio signals, video call signals, ortext/multimedia messages.

The lower cover 900 may be disposed below the main circuit board 700 andthe battery 790. The lower cover 900 may be coupled and fixed to thebracket 600. The lower cover 900 may form the bottom exterior of thedisplay device 10. The lower cover 900 may include plastic, a metal, orboth.

A second camera hole CMH2, through which the bottom surface of the firstcamera sensor 720 is exposed, may be formed in the lower cover 900. Thelocations of the first camera sensor 720 and the first and second cameraholes CMH1 and CMH2, which correspond to the first camera sensor 720,are not particularly limited.

FIG. 3 is a plan view illustrating the display panel of the displaydevice of FIG. 1. FIG. 4 is a block diagram illustrating the displaypanel and the display driving circuit of the display device of FIG. 1.

Referring to FIGS. 3 and 4, the display panel 300 may include the sensorarea SDA, which includes first subpixels SP1, the main area MDA, whichincludes second subpixels SP2, and the non-display area NDA, whichincludes neither the first subpixels SP1 nor the second subpixels SP2.The first subpixels SP1 and the second subpixels SP2 may be disposed inthe sensor area SDA and the main area MDA along with scan lines SL,emission lines ECL, data lines DL, and first driving voltage lines VDDL,which are connected to the first subpixels SP1 and the second subpixelsSP2. The scan lines SL and the emission lines ECL may extend primarilyin the first direction (e.g. the X-axis direction), and the data linesDL may extend primarily in the second direction (e.g. the Y-axisdirection), which intersects the first direction (e.g. the X-axisdirection). In the display area DA, the first driving voltage lines VDDLmay extend primarily in the second direction (e.g. the Y-axisdirection). The first driving voltage lines VDDL may be connected to oneanother in the non-display area NDA.

The first subpixels SP1 and the second subpixels SP2 may each beconnected to at least one of the scan lines SL, at least one of theemission lines ECL, and one of the first driving voltage lines VDDL. Forconvenience, FIGS. 3 and 4 illustrate that the first subpixels SP1 andthe second subpixels SP2 are each connected to two scan lines SL, onedata line DL, one emission line ECL, and one first driving voltage lineVDDL, but the present disclosure is not limited thereto. Alternatively,each of the second subpixels SP2 may be connected to three scan linesSL.

The first subpixels SP1 and the second subpixels SP2 may each include adriving transistor, one or more transistors ST, a light-emittingelement, and capacitors. The driving transistor may emit light byproviding a driving current to the light-emitting element in accordancewith a data voltage applied to the gate electrode thereof. The drivingtransistor and the transistors may be thin-film transistors (TFTs). Thelight-emitting element may emit light in accordance with the drivingcurrent provided thereto by the driving transistor. The light-emittingelement may be an OLED including a first electrode, an organiclight-emitting layer, and a second electrode. The capacitors mayuniformly maintain the data voltage applied to the gate electrode of thedriving transistor.

The non-display area NDA may be defined as an area on the display panel300, other than the main area MDA and the sensor area SDA. Thenon-display area NDA may therefore not include any subpixels. The scandriving circuit 400, which applies scan signals to the scan lines SL,fan-out lines FL, which connect the data lines DL, the display drivingcircuit 320, and pads DP, which are connected to the display drivingcircuit 320, may each be disposed in the non-display area NDA. Thedisplay driving circuit 320 and the pads DP may be disposed on one sideof the display panel 300. The pads DP may be disposed closer than thedisplay driving circuit 320 to one side of the display panel 300.

The scan driver 410 may be connected to the display driving circuit 320via a plurality of first scan control lines SCL1. The scan driver 410may receive scan control signals SCS from the display driving circuit320 via the first scan control lines SCL1. The scan driver 410 maygenerate scan signals in accordance with the scan control signals SCSand may sequentially output the scan signals to the scan lines SL.

An emission control driver 420 may be connected to the display drivingcircuit 320 via a plurality of second scan control lines SCL2. Theemission control driver 420 may receive emission control signals ECSfrom the display driving circuit 320 via the second scan control linesSCL2. The emission control driver 420 may generate emission controlsignals in accordance with the emission control signals ECS and maysequentially output the emission control signals to the emission linesECL.

As illustrated in FIG. 3, the scan driver 410 may be disposed on oneside of each of the main area MDA and the sensor area SDA, and theemission control driver 420 may be disposed on the other side of each ofthe main area MDA and the sensor area SDA. Alternatively, the scandriver 410 and the emission control driver 420 may both be disposed onthe other side of each of the main area MDA and the sensor area SDA.

The scan driver 410 may include a plurality of TFTs for generating scansignals in accordance with the scan control signals SCS, and theemission control driver 420 may include a plurality of TFTs forgenerating emission control signals in accordance with the emissioncontrol signals ECS. In this case, the TFTs of the scan driver 410 andthe TFTs of the emission control driver 420 may be formed in the samelayer as the TFTs of each of the first subpixels SP1 and the TFTs ofeach of the second subpixels SP2.

The display driving circuit 320 may include a timing controller 321 anda data driver 322, as illustrated in FIG. 4

The timing controller 321 may receive digital video data DATA and timingsignals from the display circuit board 310. The timing controller 321may generate the scan control signals SCS, which are for controlling theoperation timing of the scan driver 410 in accordance with the timingsignals, may generate the emission control signals ECS, which are forcontrolling the operation timing of the emission control driver 420, andthe data control signals DCS, which are for controlling the operationtiming of the data driver 322. The timing controller 321 may output thescan control signals SCS to the scan driver 410 via a plurality of scancontrol lines SCL and may output the emission control signals ECS to theemission control driver 420. The timing controller 321 may output thedigital video data DATA and the data control signals DCS to the datadriver 322.

The data driver 322 may convert the digital video data DATA intopositive/negative analog data voltages and may output the analog datavoltages to the data lines DL via the fan-out lines FL. Subpixels SP maybe selected by the scan signals from the scan driving circuit 400, anddata voltages may be provided to the selected subpixels SP.

The power supply unit 340 may generate a first driving voltage and mayprovide the first driving voltage to the first driving voltage linesVDDL. Also, the power supply unit 340 may generate a second drivingvoltage and may provide the second driving voltage to the cathodeelectrodes of the OLEDs of the first subpixels SP1 and to the cathodeelectrodes of the OLEDs of the second subpixels SP2. The first drivingvoltage may be a high-potential voltage for driving OLEDs, and thesecond driving voltage may be a low-potential voltage for driving theOLEDs. For example, the first driving voltage may have a higherpotential than the second driving voltage. The power supply unit 340 maygenerate driving voltages for driving the display driving circuit 320and the scan driving circuit 400, e.g., a display driving voltage, agate-high voltage, a gate-low voltage, and the like, and may provide thegenerated driving voltages to the display driving circuit 320.

The display driving circuit 320 may be an IC and may be attached on thedisplay panel 300 in a COG or COP manner or through ultrasonic bonding,but the present disclosure is not limited thereto. For example, thedisplay driving circuit 320 may be attached on the display circuit board310.

FIG. 5 is a plan view illustrating the first subpixels, the scan lines,the data lines, and the first driving voltage lines in the sensor areaof the display device of FIG. 1. FIG. 6 is a plan view illustrating thesecond subpixels, the scan lines, the data lines, and the first drivingvoltage lines in the main area of the display device of FIG. 1.

For convenience, FIG. 5 illustrates (k−1)-, k-, and (k+1)-th scan linesSk−1, Sk, and Sk+1 (where k is an integer of 2 or greater), j-, (j+1)-,(j+2)-, and (j+3)-th data lines D_(j), D_(j+1), D_(j+2), and D_(j+3)(where j is a positive integer), and k- and (k+1)-th emission lines Ekand Ek+1.

Also, for convenience, FIG. 6 illustrates (p−1)-, p-, (p+1)-, (p+2)-,and (p+3)-th scan lines Sp−1, Sp, Sp+1, Sp+2, Sp+3 (where p is aninteger of 2 or greater), g-, (g+1)-, (g+2)-, (g+3)-, (g+4)-, (g+5)-,(g+6)-, and (g+7)-th data lines D_(g), D_(g+1), D_(g+2), D_(g+3),D_(g+4), D_(g+5), D_(g+6), and D_(g+7) (where g is a positive integer),and p-, (p+1)-, (p+2)-, and (p+3)-th emission lines Ep, Ep+1, Ep+2, andEp+3.

Referring to FIGS. 5 and 6, the sensor area SDA includes the firstsubpixels SP1 and a light-transmitting area TA which is at leastpartially surrounded by the first subpixels SP. The main area MDAincludes the second subpixels SP2. The main area MDA does not includethe light-transmitting area TA. Due to the presence of thelight-transmitting area TA, the number of first subpixels SP1 in thesensor area SDA may be smaller than the number of second subpixels SP2in the main area MDA.

In a plan view, each of the first subpixels SP1 may have a substantiallyrectangular shape having a pair of short sides extending primarily inthe first direction (e.g. the X-axis direction) and a pair of long sidesextending primarily in the second direction (e.g. the Y-axis direction).In a plan view, each of the first subpixels SP may have a substantiallysquare shape, as illustrated in FIG. 5, but the present disclosure isnot limited thereto.

Each of the second subpixels SP2 may include a main pixel portion MP, afirst protruding pixel portion PP1, and a second protruding pixelportion PP2. In a plan view, the main pixel portion MP may have asubstantially rectangular shape having a pair of short sides extendingprimarily in the first direction (e.g. the X-axis direction) and a pairof long sides extending primarily in the second direction (e.g. theY-axis direction). The first and second protruding pixel portions PP1and PP2 may have a substantially rectangular shape in a plan view. Thefirst protruding pixel portion PP1 may protrude from the upper side ofthe main pixel portion MP, and the second protruding pixel portion PP2may protrude from the lower side of the main pixel portion MP.Specifically, the first protruding pixel portion PP1 may protrude from aportion of the upper side of the main pixel portion MP adjacent to theleft side of the main pixel portion MP, and the second protruding pixelportion PP2 may protrude from a portion of the lower side of the mainpixel portion MP adjacent to the right side of the main pixel portionMP.

In the sensor area SDA, particularly, in a pixel area PA that at leastpartially overlaps with the first subpixels SP1, initialization voltagelines VIL, the (k−1)-, k-, and (k+1)-th scan lines Sk−1, Sk, and Sk+1,and the k- and (k+1)-th emission lines Ek and Ek+1 may extend primarilyin the first direction (e.g. the X-axis direction). In the pixel area PAof the sensor area SDA, the first driving voltage lines VDDL, the j-,(j+1)-, (j+2)-, and (j+3)-th data lines D_(j), D_(j+1), D_(j+2), andD_(j+3) may extend primarily in the second direction (e.g. the Y-axisdirection).

In the main area MDA, the initialization voltage lines VIL, the (p−1)-,p-, (p+1)-, (p+2)-, and (p+3)-th scan lines Sp−1, Sp, Sp+1, Sp+2, Sp+3,and the p-, (p+1)-, (p+2)-, and (p+3)-th emission lines Ep, Ep+1, Ep+2,and Ep+3 may extend primarily in the first direction (e.g. the X-axisdirection). In the main area MDA, the first driving voltage lines VDDLand the g-, (g+1)-, (g+2)-, (g+3)-, (g+4)-, (g+5)-, (g+6)-, and (g+7)-thdata lines D_(g), D_(g+1), D_(g+2), D_(g+3), D_(g+4), D_(g+5), D_(g+6),and D_(g+7) may extend primarily in the second direction (e.g. theY-axis direction).

Each of the first subpixels SP1 may at least partially overlap with oneinitialization voltage line VIL, two scan lines SL, and one emissionline ECL. For example, each of the first subpixels SP1 may at leastpartially overlap with four lines that are arranged in the firstdirection (e.g. the X-axis direction).

Each of the second subpixels SP2 may at least partially overlap with twoinitialization voltage lines VIL, three scan lines SL, and one emissionline ECL. For example, each of the second subpixels SP2 may at leastpartially overlap with six lines that are arranged in the firstdirection (e.g. the X-axis direction).

The number of transistors provided in each of the first subpixels SP1may be smaller than the number of transistors provided in each of thesecond subpixels SP2, as illustrated in FIGS. 7 and 8. Thus, the numberof lines arranged in the first direction (e.g. the X-axis direction) toat least partially overlap with each of the first subpixels SP1 may besmaller than the number of lines arranged in the first direction (e.g.the X-axis direction) to at least partially overlap with each of thesecond subpixels SP2.

The first subpixels SP1 and the second subpixels SP2 may each at leastpartially overlap with one data line and one first driving voltage lineVDDL. For example, the first subpixels SP1 and the second subpixels SP2may each at least partially overlap with two lines arranged in thesecond direction (e.g. the Y-axis direction).

The light-transmitting area TA may be at least partially surrounded bythe first subpixels SP1. FIG. 5 illustrates that the light-transmittingarea TA has a substantially rectangular shape in a plan view, but thepresent disclosure is not limited thereto. Alternatively, thelight-transmitting area TA may have a shape other than a substantiallyrectangular shape, such as, for example, another polygonal shape, acircular shape, an elliptical shape, or an amorphous shape.

A wiring area LA may be disposed between the light-transmitting area TAand the first subpixels SP1. The wiring area LA may be disposed to atleast partially surround the light-transmitting area TA.

As the size of the wiring area LA decreases, the size of thelight-transmitting area TA increases. Accordingly, the distance betweeneach pair of adjacent lines among the initialization voltage lines VIL,the (k−1)-, k-, and (k+1)-th scan lines Sk−1, Sk, and Sk+1, and the k-and (k+1)-th emission lines Ek and Ek+1 may be smaller in the wiringarea LA than in the pixel area PA. Also, the distance between each pairof adjacent lines among the first driving voltage lines VDDL and the j-,(j+1)-, (j+2)-, and (j+3)-th data lines D_(j), D_(j+1), D_(j+2), andD_(j+3) may be smaller in the wiring area LA than in the pixel area PA.

The initialization voltage lines VIL, the (k−1)-, k-, and (k+1)-th scanlines Sk−1, Sk, and Sk+1, and the k- and (k+1)-th emission lines Ek andEk+1 may be bent at least once in the wiring area LA. For example, theinitialization voltage lines VIL, the (k−1)-, k-, and (k+1)-th scanlines Sk−1, Sk, and Sk+1, and the k- and (k+1)-th emission lines Ek andEk+1 may be bent four times in the wiring area LA.

The first driving voltage lines VDDL and the j-, (j+1)-, (j+2)-, and(j+3)-th data lines D_(j), D_(j+1), D_(j+2), and D_(j+3) may be bent atleast once in the wiring area LA. For example, the first driving voltagelines VDDL and the j-, (j+1)-, (j+2)-, and (j+3)-th data lines D_(j),D_(j+1), D_(j+2), and D_(j+3) may be bent four times in the wiring areaLA.

The initialization voltage lines VIL, the (k−1)-, k-, and (k+1)-th scanlines Sk−1, Sk, and Sk+1, and the k- and (k+1)-th emission lines Ek andEk+1 may each at least partially overlap with at least one of thefollowing lines: the first driving voltage lines VDDL and the j-,(j+1)-, (j+2)-, and (j+3)-th data lines D_(j), D_(j+1), D_(j+2), andD_(j+3). The first driving voltage lines VDDL and the j-, (j+1)-,(j+2)-, and (j+3)-th data lines D_(j), D_(j+1), D_(j+2), and D_(j+3) mayeach at least partially overlap with at least one of the followinglines: the initialization voltage lines VIL, the (k−1)-, k-, and(k+1)-th scan lines Sk−1, Sk, and Sk+, and the k- and (k+1)-th emissionlines Ek and Ek+1.

According to the structures illustrated in FIGS. 5 and 6, since thesensor area SDA of the display panel 300 includes the light-transmittingarea TA, light can be incident upon the sensor devices (740, 750, 760,and 770), which are disposed on the bottom surface of the display panel300, from the top surface of the display device 10 through thelight-transmitting area TA, even if the sensor devices (740, 750, 760,and 770) are disposed to at least partially overlap with the sensor areaSDA in the thickness direction of the display panel 300, i.e., in thethird direction (e.g. the Z-axis direction). Therefore, the degradationof the sensing capabilities of the sensor devices (740, 750, 760, and770) can be prevented or reduced.

FIG. 7 is a circuit diagram of an exemplary first subpixel.Specifically, FIG. 7 illustrates a first subpixel SP1 connected to the(k−1)- and k-th scan lines Sk−1 and Sk and the j-th data line D_(j).

Referring to FIG. 7, the first subpixel SP1 may at least partiallyoverlap with the (k−1)- and k-th scan lines Sk−1 and Sk and the j-thdata line D_(j). Also, the first subpixel SP1 may be connected to afirst driving voltage line VDDL to which the first driving voltage isprovided, an initialization voltage line VIL to which an initializationvoltage Vini is provided, and a second driving voltage line VSSL towhich the second driving voltage is provided.

The first subpixel SP1 includes a driving transistor DT, alight-emitting element EL, switching elements, a first capacitor C1, anda second capacitor C2. The switching elements may include first, second,third, fourth, and fifth transistors ST1, ST2, ST3, ST4, and ST5.

The driving transistor DT may include a gate electrode DT_G, a firstelectrode, and a second electrode. The driving transistor DT controls adrain-source current Ids (hereinafter, the driving current Ids) inaccordance with a data voltage applied to the gate electrode DT_G. Thedriving current Ids, which flows through the channel of the drivingtransistor DT, is proportional to the square of the difference between athreshold voltage and a voltage Vgs between the gate electrode DT_G anda source electrode of the driving transistor DT, as shown in Equation(1):

Ids=k′×(Vgs−Vth)²

where k′ denotes a proportional coefficient determined by the structureand the physical characteristics of the driving transistor DT, Vgsdenotes the gate-source voltage of the driving transistor DT, and Vthdenotes the threshold voltage of the driving transistor DT.

The light-emitting element EL emits light in accordance with the drivingcurrent Ids. The amount of light emitted by the light-emitting elementEL may be proportional to the driving current Ids.

The light-emitting element EL may be an OLED including an anodeelectrode, a cathode electrode, and an organic light-emitting layer,which is disposed between the anode electrode and the cathode electrode.Alternatively, the light-emitting element EL may be an ILED including ananode electrode, a cathode electrode, and an inorganic semiconductor,which is disposed between the anode electrode and the cathode electrode.Yet alternatively, the light-emitting element EL may be a QLED includingan anode electrode, a cathode electrode, and a quantum-dotlight-emitting layer, which is disposed between the anode electrode andthe cathode electrode. Yet still alternatively, the light-emittingelement EL may be an mLED.

The anode electrode of the light-emitting element EL may be connected toa second electrode of the fifth transistor ST5, and the cathodeelectrode of the light-emitting element EL may be connected to thesecond driving voltage line VSSL. Parasitic capacitance Ce1 may beformed between the anode electrode and the cathode electrode of thelight-emitting element EL.

The first transistor ST1 may be a dual transistor including (1-1)- and(1-2)-th transistors ST1-1 and ST1-2. The (1-1)- and (1-2)-thtransistors ST1-1 and ST1-2 are turned on by a scan signal from the(k−1)-th scan line Sk−1 to connect the gate electrode of the drivingtransistor DT and the initialization voltage line VIL. The gateelectrode of the driving transistor DT may be discharged to as low asthe initialization voltage Vini of the initialization voltage line VL.The gate electrode of the (1-1)-th transistor ST1-1 may be connected tothe (k−1)-th scan line Sk−1, the first electrode of the (1-1)-thtransistor ST1-1 may be connected to the gate electrode of the drivingtransistor DT, and the second electrode of the (1-1)-th transistor ST1-1may be connected to the first electrode of the (1-2)-th transistorST1-2. The gate electrode of the (1-2)-th transistor ST1-2 may beconnected to the (k−1)-th scan line Sk−1, the first electrode of the(1-2)-th transistor ST1-2 may be connected to the second electrode ofthe (1-1)-th transistor ST1-1, and the second electrode of the (1-2)-thtransistor ST1-2 may be connected to the initialization voltage lineVIL.

The second transistor ST2 is turned on by a scan signal from the k-thsignal Sk to connect the first electrode of the driving transistor DTand the j-th data line D_(j). The gate electrode of the secondtransistor ST2 may be connected to the k-th scan line Sk, the firstelectrode of the second transistor ST2 may be connected to the firstelectrode of the driving transistor DT, and the second electrode of thesecond transistor ST2 may be connected to the j-th data line D_(j).

The third transistor ST3 may be a dual transistor including (3-1)- and(3-2)-th transistors ST3-1 and ST3-2. The (3-1)- and (3-2)-thtransistors ST3-1 and ST3-2 are turned on by the scan signal from the(k−1)-th scan line Sk−1 to connect the gate electrode and the secondelectrode of the driving transistor DT. For example, when the (3-1)- and(3-2)-th transistors ST3-1 and ST3-2 are turned on, the gate electrodeand the second electrode of the driving transistor DT are connected, andas a result, the driving transistor DT operates as a diode. The gateelectrode of the (3-1)-th transistor ST3-1 may be connected to the k-thscan line Sk, the first electrode of the (3-1)-th transistor ST3-1 maybe connected to the second electrode of the driving transistor DT, andthe second electrode of the (3-1)-th transistor ST3-1 may be connectedto the first electrode of the (3-2)-th transistor ST3-2. The gateelectrode of the (3-2)-th transistor ST3-2 may be connected to the k-thscan line Sk, the first electrode of the (3-2)-th transistor ST3-2 maybe connected to the second electrode of the (3-1)-th transistor ST3-1,and the second electrode of the (3-2)-th transistor ST3-2 may beconnected to the gate electrode of the driving transistor DT.

The fourth transistor ST4 is turned on by an emission control signalfrom the k-th emission line Ek to connect the first electrode of thedriving transistor DT and the first driving voltage line VDDL. The gateelectrode of the fourth transistor ST4 may be connected to the k-themission line Ek, the first electrode of the fourth transistor ST4 maybe connected to the first driving voltage line VDDL, and the secondelectrode of the fourth transistor ST4 may be connected to the sourceelectrode of the driving transistor DT.

The fifth transistor ST5 is connected between the second electrode ofthe driving transistor DT and the anode electrode of the light-emittingelement EL. The fifth transistor ST5 is turned on by the emissioncontrol signal from the k-th emission line Ek to connect the secondelectrode of the driving transistor DT and the anode electrode of thelight-emitting element EL. The gate electrode of the fifth transistorST5 is connected to the k-th emission line Ek, the first electrode ofthe fifth transistor ST5 is connected to the second electrode of thedriving transistor DT, and the second electrode of the fifth transistorST5 is connected to the anode electrode of the light-emitting elementEL. When the fourth and fifth transistors ST4 and ST5 are both turnedon, the driving current Ids may be provided to the light-emittingelement EL.

The first capacitor C1 is formed between the second electrode of thedriving transistor DT and the first driving voltage line VDDL. The firstelectrode of the first capacitor C1 may be connected to the secondelectrode of the driving transistor DT, and the second electrode of thefirst capacitor C2 may be connected to the first driving voltage lineVDDL.

In a case where the first electrodes of the first through fifthtransistors ST1 through ST5 and the first electrode of the drivingtransistor DT are source electrodes, the second electrodes of the firstthrough fifth transistors ST1 through ST5 and the second electrode ofthe driving transistor DT may be drain electrodes. In a case where thefirst electrodes of the first through fifth transistors ST1 through ST5and the first electrode of the driving transistor DT are drainelectrodes, the second electrodes of the first through fifth transistorsST1 through ST5 and the second electrode of the driving transistor DTmay be source electrodes.

The first through fifth transistors ST1 through ST5 and the drivingtransistor DT may be formed of one of polysilicon, amorphous silicon, oran oxide semiconductor. In a case where the first through fifthtransistors ST1 through ST5 and the driving transistor DT are formed ofpolysilicon, the first through fifth transistors ST1 through ST5 and thedriving transistor DT may be formed by a low-temperature polysilicon(LTPS) process.

FIG. 7 illustrates that the first through fifth transistors ST1 throughST5 and the driving transistor DT are P-type metal-oxide-semiconductorfield-effect transistors (MOSFETs), but the present disclosure is notlimited thereto. Alternatively, the first through fifth transistors ST1through ST5 and the driving transistor DT are N-type MOSFETs.

FIG. 8 is a circuit diagram of an exemplary second subpixel.Specifically, FIG. 8 illustrates a second subpixel SP2 connected to the(p−1)- and p-th scan line Sp−1 and Sp and the g-th data line D_(g).

The second subpixel SP2 of FIG. 8 differs from the first subpixel SP1 ofFIG. 7 in that it further includes a sixth transistor ST6. The secondsubpixel SP2 of FIG. 8 will hereinafter be described, focusing mainly onthe differences with the first subpixel SP1 of FIG. 7. It will thereforebe assumed that to the extent that certain details concerning the secondsubpixel SP2 are not described below, these details may be at leastsimilar to corresponding details concerning the first subpixel SP1described herein.

Referring to FIG. 8, the sixth transistor ST6 is turned on by a scansignal from the p-th scan line Sp to connect the anode electrode of alight-emitting element EL and an initialization voltage line VIL. Theanode electrode of the light-emitting element may be discharged to aslow as an initialization voltage Vini of the initialization voltage lineVIL. The gate electrode of the sixth transistor ST6 is connected to thep-th scan line Sp, the first electrode of the sixth transistor ST6 isconnected to the anode electrode of the light-emitting element EL, andthe second electrode of the sixth transistor ST6 is connected to theinitialization voltage line VIL.

According to the embodiment of FIGS. 7 and 8, each of the firstsubpixels SP includes six transistors, and each of the second subpixelSP2 includes seven transistors. For example, the number of transistorsprovided in each of the first subpixel SP1 may be smaller than thenumber of transistors provided in each of the second subpixel SP2.Accordingly, the wiring area LA can be provided in a region where thesixth transistors ST6 are not provided, and as a result, thelight-transmitting area TA can be widened.

The sixth transistors ST6 of the second subpixels SP2 lower the voltageat the anode electrodes of the light-emitting elements EL to as low asthe initialization voltage Vini. Thus, when the light-emitting elementsEL display black, the sixth transistors ST6 of the second subpixels SP2can prevent black from becoming visible to the user during a period whenthe fifth transistors ST5 of the second subpixels SP2 are turned off.However, since the period when the fifth transistors ST5 of the secondsubpixels SP2 are turned off is very short and the number of firstsubpixels SP1 provided in the sensor area SDA is smaller than the numberof second subpixels SP2 provided in the main area MDA, the black becomesbarely visible to the user. Accordingly, the sixth transistors ST6 mightnot be provided in the first subpixels SP1.

FIG. 9 is a plan view illustrating the first subpixel of FIG. 7.

Referring to FIG. 9, the first subpixel SP1 may include the drivingtransistor DT, the first through fifth transistors ST1 through ST5, andthe first capacitor C1.

The driving transistor DT may include an active layer DT_ACT, a gateelectrode DT_G, a first electrode DT_S, and a second electrode DT_D. Theactive layer DT_ACT of the driving transistor DT may at least partiallyoverlap with the gate electrode DT_G of the driving transistor DT. Thegate electrode DT_G of the driving transistor DT may be connected to afirst connecting electrode BE1 through a first contact hole CNT. Thefirst connecting electrode BE1 may be connected to a first electrodeS1-1 of a (1-1)-th transistor ST1-1 and a drain electrode D3-2 of a(3-2)-th transistor ST3-2 through a second contact hole CNT2. The firstconnecting electrode BE1 may intersect a k-th scan line Sk. The firstelectrode DT_S of the driving transistor DT may be connected to a firstelectrode S2 of the second transistor ST2. The second electrode DT_D ofthe driving transistor DT may be connected to a first electrode S3-1 ofa (3-1)-th transistor ST3-1 and a first electrode S5 of the fifthtransistor ST5.

The first transistor ST1 may be a dual transistor. The first transistorST1 may include the (1-1)-th transistor ST1-1 and a (1-2)-th transistorST1-2.

The (1-1)-th transistor ST1-1 may include an active layer ACT1-1, a gateelectrode G1-1, the first electrode S1-1, and a second electrode D1-1.The gate electrode G1-1 of the (1-1)-th transistor ST1-1 may correspondto a portion of a (k−1)-th scan line Sk−1, particularly, a portion ofthe (k−1)-th scan line Sk−1 that at least partially overlaps with theactive layer ACT1-1 of the (1-1)-th transistor ST1-1. The firstelectrode S1-1 of the (1-1)-th transistor ST1-1 may be connected to thefirst connecting electrode BE1 of the driving transistor DT through thesecond contact hole CNT2. The second electrode D1-1 of the (1-1)-thtransistor ST1-1 may be connected to a first electrode S1-2 of the(1-2)-th transistor ST1-2.

The (1-2)-th transistor ST1-2 may include an active layer ACT1-2, a gateelectrode G1-2, the first electrode S1-2, and a second electrode D1-2.The gate electrode G1-2 of the (1-2)-th transistor ST1-2 may correspondto a portion of the (k−1)-th scan line Sk−1, particularly, a portion ofthe (k−1)-th scan line Sk−1 that at least partially overlaps with theactive layer ACT1-2 of the (1-2)-th transistor ST1-2. The firstelectrode S1-2 of the (1-2)-th transistor ST1-2 may be connected to thesecond electrode D1-1 of the (1-1)-th transistor ST1-1. The secondelectrode D1-2 of the (1-2)-th transistor ST1-2 may be connected to aninitialization connecting electrode VIE through a fourth contact holeCNT4.

The second transistor ST2 may include an active layer ACT2, a gateelectrode G2, a first electrode S2, and a second electrode D2. The gateelectrode G2 of the second transistor ST2 may correspond to a portion ofthe k-th scan line Sk, particularly, a portion of the k-th scan line Skthat at least partially overlaps with the active layer ACT2 of thesecond transistor ST2. The first electrode S2 of the second transistorST2 may be connected to the first electrode DT_S of the drivingtransistor DT. The second electrode D2 of the second transistor ST2 maybe connected to the j-th data line D_(j) through a third contact holeCNT3.

The third transistor ST3 may be a dual transistor. The third transistorST3 may include the (3-1)-th transistor ST3-1 and a (3-2)-th transistorST3-2.

The (3-1)-th transistor ST3-1 may include an active layer ACT3-1, a gateelectrode G3-1, the first electrode S3-1, and a second electrode D3-1.The gate electrode G3-1 of the (3-1)-th transistor ST1-1 may correspondto a portion of the k-th scan line Sk, particularly, a portion of the-th scan line Sk that at least partially overlaps with the active layerACT3-1 of the (3-1)-th transistor ST3-1. The first electrode S3-1 of the(3-1)-th transistor ST3-1 may be connected to the second electrode DT_Dof the driving transistor DT. The second electrode D3-1 of the (3-1)-thtransistor ST3-1 may be connected to a first electrode S3-2 of the(3-2)-th transistor ST3-2.

The (3-2)-th transistor ST3-2 may include an active layer ACT3-2, a gateelectrode G3-2, the first electrode S3-2, and a second electrode D3-2.The gate electrode G3-2 of the (3-2)-th transistor ST3-2 may correspondto a portion of the k-th scan line Sk, particularly, a portion of thek-th scan line Sk that at least partially overlaps with the active layerACT3-2 of the (3-2)-th transistor ST3-2. The first electrode S3-2 of the(3-2)-th transistor ST3-2 may be connected to the second electrode D3-1of the (3-1)-th transistor ST3-1. The second electrode D3-2 of the(3-2)-th transistor ST3-2 may be connected to the first connectingelectrode BE1 through the second contact hole CNT2.

The fourth transistor ST4 may include an active layer ACT4, a gateelectrode G4, a first electrode S4, and a second electrode D4. The gateelectrode G4 of the fourth transistor ST4 may correspond to a portion ofa k-th emission line Ek, particularly, a portion of the k-th emissionline Ek that at least partially overlaps with the active layer ACT4 ofthe fourth transistor ST4. The first electrode S4 of the fourthtransistor ST4 may be connected to a second electrode CE12 of the firstcapacitor C1 through a seventh contact hole CNT7. The second electrodeD4 of the fourth transistor ST4 may be connected to the first electrodeDT_S of the driving transistor DT.

The fifth transistor ST5 may include an active layer ACT5, a gateelectrode G5, a first electrode S5, and a second electrode D5. The gateelectrode G5 of the fifth transistor ST5 may correspond to a portion ofthe k-th emission line Ek, particularly, a portion of the k-th emissionline Ek that at least partially overlaps with the active layer ACT5 ofthe fifth transistor ST5. The first electrode S5 of the fifth transistorST5 may be connected to the second electrode DT_D of the drivingtransistor DT. The second electrode D5 of the fifth transistor ST5 maybe connected to an anode electrode AND of the light-emitting element ELthrough a sixth contact hole CNT6.

A first electrode CE11 of the first capacitor C1 may be a portion of thegate electrode DT_G of the driving transistor DT. The second electrodeCE12 of the first capacitor C1 may be a portion of a horizontal drivingvoltage line HVDDL which is connected to a first driving voltage lineVDDL through an eighth contact hole CNT8. The first and secondelectrodes CE11 and CE12 may at least partially overlap with each other.

FIG. 10 is a plan view illustrating the second subpixel of FIG. 8.

The second subpixel SP2 of FIG. 10 differs from the first subpixel SP1of FIG. 9 in that it further includes the sixth transistor ST6. Thesecond subpixel SP2 of FIG. 10 will hereinafter be described, focusingmainly on the differences with the first subpixel SP1 of FIG. 9.

The sixth transistor ST6 may include an active layer ACT6, a gateelectrode G6, a first electrode S6, and a second electrode D6. The gateelectrode G6 of the sixth transistor ST6, which is a portion of the k-thscan line Sk may correspond to the overlapping area of the active layerACT6 of the sixth transistor ST6 and the k-th scan line Sk. A firstanode connecting electrode ANDE1 may be connected to the first electrodeS4 of the sixth transistor ST6 through a sixth contact hole CNT6. Asecond anode connecting electrode ANDE2 may be connected to the firstanode connecting electrode ANDE1 through a first anode contact holeAND_CNT1, as illustrated in FIG. 12. A first electrode 171 of thelight-emitting element EL may be connected to the first anode connectingelectrode ANDE1 through a second anode contact hole AND_CNT2, asillustrated in FIG. 11. The second electrode D6 of the sixth transistorST6 may be connected to the initialization connecting electrode VIEthrough the fourth contact hole CNT4. An initialization voltage line VILmay be connected to the initialization connecting electrode VIE throughthe fifth contact hole CNT5, and the initialization connecting electrodeVIE may be connected to the second electrode D3-2 of the (1-2)-thtransistor ST1-2 and the second electrode D4 of the sixth transistor ST6through the fourth contact hole CNT4. The initialization connectingelectrode VIE may be disposed to intersect the k-th scan line Sk.

According to the embodiment of FIGS. 9 and 10, since the sixthtransistor ST6 is not provided in the first subpixel SP1, the firstsubpixel SP1 does not include a second protruding pixel portion PP2 ofthe second subpixel SP2. For example, due to the absence of the sixthtransistor ST6, the second protruding pixel portion PP2 might not beprovided in the first subpixel SP1. Thus, when the first subpixel SP1with no second protruding pixel portion is provided in the sensor areaSDA, the wiring area LA can be disposed in a portion of the firstsubpixel SP1 from which the second protruding pixel portion PP2 isomitted, and as a result, the size of the light-transmitting area TA canbe widened as compared to when the second subpixel SP2 with the secondprotruding pixel portion PP2 is applied to the sensor area SDA.

FIG. 11 is a cross-sectional view taken along line I-I′ of FIGS. 9 and10. FIG. 12 is a cross-sectional view taken along line II-II′ of FIG. 9.FIG. 13 is a cross-sectional view taken along line II-II′ of FIG. 9.

Referring to FIGS. 11 through 13, a TFT layer TFTL, a light-emittingelement layer EML, and an encapsulation layer TFE may be sequentiallyformed on a first substrate SUB1.

The TFT layer TFTL includes a light-shielding layer BML, a buffer filmBF, an active layer ACT, a first gate layer GTL1, a second gate layerGTL2, a first source metal layer DTL1, a second source metal layer DTL2,a gate insulating film 130, a first interlayer insulating film 141, asecond interlayer insulating film 142, a passivation film 150, a firstplanarization film 160, and a second planarization film 180.

The light-shielding layer BML may be formed on one surface of the firstsubstrate SUB1. The light-shielding layer BML may be disposed to atleast partially overlap with the active layer DT_ACT of the drivingtransistor DT to prevent the generation of a leakage current in a casewhere light is incident upon the active layer DT_ACT of the drivingtransistor DT. FIGS. 11 through 13 illustrate that the light-shieldingmember BML overlaps with only the active layer DT_ACT of the drivingtransistor DT, but the present disclosure is not limited thereto. Forexample, the light-shielding layer BML may at least partially overlapthe active layer DT_ACT of the driving transistor DT, and also may atleast partially overlap the active layers ACT through ACT6 of the firstthrough sixth transistors ST1 through ST6. The light-shielding layer BMLmay be a single- or multilayer film including molybdenum (Mo), aluminum(Al), chromium (Cr), gold (Au), titanium (Ti), Ni, neodymium (Nd), Cu,or an alloy thereof.

The buffer film BF may be formed on the light-shielding layer BML. Thebuffer film may be formed on the first substrate SUB1 to protect theTFTs 120 and organic light-emitting layers 172 of the light-emittingelement layer EML against moisture that may penetrate the TFTs 120 andthe organic light-emitting layers 172 through the first substrate SUB1.The buffer film BF may include a plurality of inorganic films that arealternately stacked. For example, the buffer film BF may be a multilayerfilm in which at least one of a silicon nitride layer, a siliconoxynitride layer, a silicon oxide layer, a titanium oxide layer, and analuminum oxide layer is alternately stacked. The buffer film BF may beomitted.

The active layers ACT may be formed on the first substrate SUB1 or onthe buffer film BF. The active layer ACT may include polycrystallinesilicon, monocrystalline silicon, low-temperature polycrystallinesilicon, amorphous silicon, and/or an oxide semiconductor. In a casewhere the active layer ACT is formed of polycrystalline silicon, theactive layer ACT may be electrically conductive. Accordingly, the activelayer ACT may include the active layer DT_ACT of the driving transistorDT and the active layers ACT1, ACT2, ACT3, ACT4, ACT5, and ACT6 of thefirst through sixth transistors ST1 through ST6, and may also includethe source and drain electrodes DT_S and DT_D of the driving transistorDT and the source electrodes S1, S2-1, S2-2, S3-1, S3-2, S4, S5, and S6and the drain electrodes D1, D2-1, D2-2, D3-1, D3-2, D4, D5, and D6 ofthe first through sixth transistors ST through ST6.

The gate insulating film 130 may be formed on the active layer ACT. Thegate insulating film 130 may be an inorganic film, for example, asilicon nitride layer, a silicon oxynitride layer, a silicon oxidelayer, a titanium oxide layer, and/or an aluminum oxide layer.

The first gate layer GTL1 may be formed on the gate insulating film 130.The first gate layer GTL1 may include not only the gate electrode DT_Gof the driving transistor DT and the gate electrodes G1 through G6 ofthe first through sixth transistors ST1 through ST6, but also the scanlines SL and the emission lines ECL. The first gate layer GTL1 may be asingle- or multilayer film including Mo, Al, Cr, Au, Ti, Ni. Nd, Cu, oran alloy thereof.

The first interlayer insulating film 141 may be formed on the first gatelayer GTL1. The first interlayer insulating film 141 may be an inorganicfilm such as, for example, a silicon nitride layer, a silicon oxynitridelayer, a silicon oxide layer, a titanium oxide layer, or an aluminumoxide layer. The first interlayer insulating film 141 may include aplurality of inorganic films.

The second gate layer GTL2 may be formed on the first interlayerinsulating film 141. The second gate layer GTL2 may include theinitialization voltage line VIL and the second electrode CE2 of thefirst capacitor C1. The second gate layer GTL2 may be a single- ormultilayer film including Mo, Al, Cr, Au, Ti, Ni, Nd, Cu, or an alloythereof.

The second interlayer insulating film 142 may be formed on the secondgate layer GTL2. The second interlayer insulating film 142 may be aninorganic film such as, for example, a silicon nitride layer, a siliconoxynitride layer, a silicon oxide layer, a titanium oxide layer, or analuminum oxide layer. The second interlayer insulating film 142 mayinclude a plurality of inorganic films.

The first source metal layer DTL1 may be formed on the second interlayerinsulating film 142. The first source metal layer DTL1 may include thedata line DL, the first driving voltage line VDDL, the first connectingelectrode BE1, the first anode connecting electrode ANDE1, and theinitialization connecting electrode VIE. The first source metal layerDTL1 may be a single- or multilayer film including Mo, Al, Cr, Au, Ti,Ni, Nd, Cu, or an alloy thereof.

The first planarization film 160 may be formed on the first source metallayer DTL1 to planarize height differences formed by the active layerACT, the first gate layer GTL1, the second gate layer GTL2, and thefirst source metal layer DTL1. The first planarization film 160 may bean organic film including an acrylic resin, an epoxy resin, a phenolicresin, a polyamide resin, and/or a polyimide resin.

The passivation film 150 may be additionally formed between the firstsource metal layer DTL1 and the first planarization film 160. Thepassivation film 150 may be an inorganic film such as, for example, asilicon nitride layer, a silicon oxynitride layer, a silicon oxidelayer, a titanium oxide layer, and/or an aluminum oxide layer.

The second source metal layer DTL2 may be formed on the firstplanarization film 160. The second source metal layer DTL2 may includethe second anode connecting electrode ANDE2. The second source metallayer DTL2 may be a single- or multilayer film including Mo, Al, Cr, Au,Ti, Ni, Nd, Cu, or an alloy thereof.

The second planarization film 180 may be formed on the second sourcemetal layer DTL2. The second planarization film 180 may be an organicfilm including an acrylic resin, an epoxy resin, a phenolic resin, apolyamide resin, and/or a polyimide resin.

The driving transistor DT and the first through sixth transistors ST1through ST6 may be top-gate transistors in which gate electrodes aredisposed above active layers, but the present disclosure is not limitedthereto. Alternatively, the driving transistor DT and the first throughsixth transistors ST1 through ST6 may be bottom-gate transistors inwhich gate electrodes are disposed below active layers or double-gatetransistors in which gate electrodes are disposed above and below activelayers.

The first contact hole CNT1 may be a hole which penetrates the first andsecond interlayer insulating films 141 and 142 and exposes the gateelectrode DT_G of the driving transistor DT. The first connectingelectrode BE1 may be connected to the gate electrode DT_G of the drivingtransistor DT through the first contact hole CNT1.

The second contact hole CNT2 may be a hole which exposes the firstelectrode S1-1 of the (1-1)-th transistor ST1-1 and the second electrodeD3-1 of the (3-1)-th transistor ST3-1 through the gate insulating film130 and the first and second interlayer insulating films 141 and 142.The second connecting electrode BE2 may be connected to the first S1-1of the (1-1)-th transistor ST1-1 and the second electrode D3_1 of the(3-1)-th transistor ST3-1 through the second contact hole CNT2.

The third contact hole CNT3 may be a hole which exposes the firstelectrode S2 of the second transistor ST2 through the gate insulatingfilm 130 and the first and second interlayer insulating films 141 and142. The j-th data line D_(j) may be connected to the first electrode S2of the second transistor ST2 through the third contact hole CNT3.

The fourth contact hole CNT4 may be a hole which exposes the secondelectrode D1 of the first transistor ST1 and the second electrode D4 ofthe fourth transistor ST4 through the gate insulating film 130 and thefirst and second interlayer insulating films 141 and 142. Theinitialization connecting electrode VIE may be connected to the (1-2)-thelectrode of the (1-2)-th transistor ST1-2 and the second electrode D4of the fourth transistor ST4 through the fourth contact hole CNT4.

The fifth contact hole CNT5 may be a hole which exposes theinitialization voltage line VIL through the second interlayer insulatingfilm 142. The initialization connecting electrode VIE may be connectedto the initialization voltage line VIL through the fifth contact holeCNT5.

The sixth contact hole CNT6 may be a hole which exposes the secondelectrode D5 of the fifth transistor ST5 through the gate insulatingfilm 130 and the first and second interlayer insulating films 141 and142. The first anode connecting electrode ANDE1 may be connected to thesixth transistor ST6 through the sixth contact hole CNT6.

The seventh contact hole CNT7 may be a hole which exposes the firstelectrode S4 of the fourth transistor ST4 through the gate insulatingfilm 130 and the first and second interlayer insulating films 141 and142. The first driving voltage line VDDL may be connected to the firstelectrode S4 of the fourth transistor ST4 through the seventh contacthole CNT7.

The eighth contact hole CNT8 may be a hole which exposes the horizontaldriving voltage line HVDDL through the second interlayer insulating film142. The first driving voltage line VDDL may be connected to thehorizontal driving voltage line HVDDL through the eighth contact holeCNT8.

The first anode contact hole AND_CNT1 may be a hole which exposes thefirst anode connecting electrode ANDE1 through the passivation film 150and the first planarization film 160.

The second anode contact hole AND_CNT2 may be a hole which exposes thesecond anode connecting electrode ANDE2 through the second planarizationfilm 180.

The light-emitting element layer EML is formed on the TFT layer TFTL.The light-emitting element layer EML includes light-emitting elements170 and a pixel-defining film 190.

The light-emitting elements 170 and the pixel-defining film 190 may beformed on the first planarization film 160. Each of the light-emittingelements 170 may include a first electrode 171, an organiclight-emitting layer 172, and a second electrode 173.

The first electrode 171 may be formed on the second planarization film180. The first electrode 171 may be connected to the second anodeconnecting electrode ANDE2 through the second anode contact holeAND_CNT2, which penetrates the second planarization film 180.

In a top-emission structure that emits light in a direction from theorganic light-emitting layer 172 to the second electrode 173, the firstelectrode 171 may be formed of a metallic material with high reflectancesuch as a stack of Al and Ti (e.g., Ti/Al/Ti), a stack of Al and indiumtin oxide (ITO) (e.g., ITO/Al/ITO), a silver-palladium-copper (APC)alloy, and/or a stack of an APC alloy and ITO (e.g., ITO/APC/ITO).

The pixel-defining film 190 may define the first electrode 171 over thesecond planarization film 180 and thus to define an emission area EA.The pixel-defining film 190 may cover edges of the first electrode 171.The pixel-defining film 190 may be an organic film including an acrylicresin, an epoxy resin, a phenolic resin, a polyamide resin, or apolyimide resin.

The emission area EA refers to an area where the first electrode 171,the organic light-emitting layer 172, and the second electrode 173 aresequentially stacked so that holes from the first electrode 171 andelectrons from the second electrode 173 are combined together in theorganic light-emitting layer 172 so as to emit light.

The organic light-emitting layer 172 is formed on the first electrode171 and on the pixel-defining film 190. The organic light-emitting layer172 may include an organic material and may emit light of apredetermined color. For example, the organic light-emitting layer 172may include a hole transport layer, an organic material layer, and anelectron transport layer.

The second electrode 173 may be formed on the organic light-emittinglayer 172. The second electrode 173 may cover the organic light-emittinglayer 172. The second electrode 173 may be a common layer formed incommon for all the subpixels. A capping layer may be formed on thesecond electrode 173.

In the top-emission structure, the second electrode 173 may be formed ofa transparent conductive oxide (TCO) material such as ITO or IZO or atranslucent metallic material such as magnesium (Mg), Ag, or an alloy ofMg and Ag. In a case where the second electrode 173 is formed of atranslucent metallic material, the emission efficiency of thelight-emitting element layer EML can be increased due to a micro-cavityeffect.

The encapsulation layer TFE may be formed on the light-emitting elementlayer EML. The encapsulation layer TFE may include at least oneinorganic film for preventing the penetration of oxygen or moisture intothe light-emitting element layer EML. Also, the encapsulation layer TFEmay include at least one organic film for protecting the light-emittingelement layer EML from a foreign material such as dust.

A second substrate, instead of the encapsulation layer TFE, may bedisposed on the light-emitting element layer EML. The space between thelight-emitting element layer EML and the second substrate may beevacuated, or a filling film may be disposed in the space between thelight-emitting element layer EML and the second substrate. The fillingfilm may be an epoxy filling film or a silicone filling film.

FIG. 14 is a plan view illustrating an area A of FIG. 5. FIG. 15 is across-sectional view taken along line IV-IV′ of FIG. 14.

Referring to FIGS. 14 and 15, in the wiring area LA, the k-th scan lineSk may be connected to a first scan connecting line SCE1 via a secondconnecting contact hole BCNT2. In the wiring area LA, the first drivingvoltage lines VDDL may be connected to first and second power supplyconnecting lines PCE1 and PCE2 via first connecting contact holes BCNT1.For example, one of the first driving voltage lines VDDL may beconnected to the first power supply connecting line PCE1 through a firstconnecting contact hole BCNT1, and another one of the first drivingvoltage lines VDDL may be connected to the second power supplyconnecting line PCE2 through another first connecting contact holeBCNT1.

Wiring may be entirely omitted from the light-transmitting area TA so asto increase light transmittance in the light-transmitting area TA. Forexample, as illustrated in FIG. 15, transparent materials such as thebuffer film BF, the gate insulating film 130, the first and secondinterlayer insulating films 141 and 142, the passivation film 150, thefirst and second planarization films 160 and 180, the pixel-definingfilm 190, the second electrode 173, and the encapsulation layer TFE maybe disposed in the light-transmitting area TA. Also, the buffer film BF,the gate insulating film 130, the first and second interlayer insulatingfilms 141 and 142, the passivation film 150, the first and secondplanarization films 160 and 180, the pixel-defining film 190, and theencapsulation layer TFE may be entirely or partially removed to increaselight transmittance in the light-transmitting area TA. Also, the secondelectrode 173 may be removed to increase light transmittance in thelight-transmitting area TA.

In the wiring area LA, the j-th data line D_(j) may at least partiallyoverlap with the initialization voltage line VIL, the (k−1)- and k-thscan lines Sk−1 and Sk, and the k-th emission line Ek. The overlappingarea of the j-th data line D_(j) and the initialization voltage line VILmay be greater than the overlapping area of the j-th data line D_(j) andthe (k−1)-th scan line Sk−1, the overlapping area of the j-th data lineD_(j) and the k-th scan line Sk, and the overlapping area of the j-thdata line D_(j) and the k-th emission line Ek.

In the wiring area LA, the first power supply connecting line PCE1 mayat least partially overlap with the initialization voltage line VIL, the(k−1)- and k-th scan lines Sk−1 and Sk, and the emission line Ek. Theoverlapping area of the first power supply connecting line PCE1 and the(k−1)-th scan line Sk−1 may be greater than the overlapping area of thefirst power supply connecting line PCE1 and the initialization voltageline VIL, the overlapping area of the first power supply connecting linePCE1 and the k-th scan line Sk, and the overlapping area of the firstpower supply connecting line PCE1 and the k-th emission line Ek.

In the wiring area LA, the (j+1)-th data line D_(j+1) may at leastpartially overlap with the initialization voltage line VIL, the (k−1)-and k-th scan lines Sk−1 and Sk, and the k-th emission line Ek. Theoverlapping area of the (j+1)-th data line D_(j+1) and the k-th scanline Sk may be greater than the overlapping area of the (j+1)-th dataline D_(j+1) and the initialization voltage line VIL, the overlappingarea of the (j+1)-th data line D_(j+1) and the (k−1)-th scan line Sk−1,and the overlapping area of the (j+1)-th data line D_(j+1) and the k-themission line Ek.

In the wiring area LA, the second power supply connecting line PCE2 mayat least partially overlap with the initialization voltage line VIL, the(k−1)- and k-th scan lines Sk−1 and Sk, and the emission line Ek. Theoverlapping area of the second power supply connecting line PCE2 and thek-th emission line Ek may be greater than the overlapping area of thesecond power supply connecting line PCE2 and the initialization voltageline VIL, the overlapping area of the second power supply connectingline PCE2 and the (k−1)-th scan line Sk−1, and the overlapping area ofthe second power supply connecting line PCE2 and the k-th scan line Sk.

FIGS. 14 and 15 illustrate that the first connecting contact holes BCNT1overlap with the initialization voltage line VIL, but the presentdisclosure is not limited thereto. Alternatively, the first connectingcontact holes BCNT1 may at least partially overlap with one of the(k−1)-th scan line Sk−1, the first scan connecting line SCE1, and thek-th emission line Ek. Yet alternatively, one of the first connectingcontact holes BCNT1 may at least partially overlap with one of theinitialization voltage line VIL, the (k−1)-th scan line Sk−1, the firstscan connecting line SCE1, and the k-th emission line Ek, and anotherone of the first connecting contact holes BCNT1 may at least partiallyoverlap with another one of the initialization voltage line VIL, the(k−1)-th scan line Sk−1, the first scan connecting line SCE1, and thek-th emission line Ek.

In the wiring area LA, the j- and (j+1)-th data lines D_(j) and D_(j+1)may be formed of the first source metal layer DTL1. In the wiring areaLA, the j- and (j+1)-th data lines D_(j) and D_(j+1) may be disposed onthe second interlayer insulating film 142. In the wiring area LA, thefirst and second power supply connecting lines PCE1 and PCE2 may beformed of the second source metal layer DTL2. In the wiring area LA, thefirst and second power supply connecting lines PCE1 and PCE2 may bedisposed on the first planarization film 160. For example, in the wiringarea LA, the j- and (j+1)-th data lines D_(j) and D_(j+1) may bedisposed in a different layer from the first and second power supplyconnecting lines PCE1 and PCE2.

In a case where in the wiring area LA, the j- and (j+1)-th data lines Dand D_(j+1) and the first and second power supply connecting lines PCE1and PCE2 are disposed in the same layer, the j- and (j+1)-th data linesD_(j) and D_(j+1) and the first and second power supply connecting linesPCE1 and PCE2 may be short-circuited due to process error if thedistance between each pair of adjacent lines among the j- and (j+1)-thdata lines D_(j) and D_(j+1) and the first and second power supplyconnecting lines PCE1 and PCE2 is smaller than a predetermined minimumdistance. Thus, in a case where the j- and (j+1)-th data lines D_(j) andD_(j+1) and the first and second power supply connecting lines PCE1 andPCE2 are disposed in the same layer, the j- and (j+1)-th data linesD_(j) and D_(j+1) and the first and second power supply connecting linesPCE1 and PCE2 may be formed at a distance greater than a predefinedminimum distance from one another in consideration of process error.

In a case where in the wiring area LA, the j- and (j+1)th data linesD_(j) and D_(j+1) and the first and second power supply connecting linesPCE1 and PCE2 are disposed in different layers, each pair of adjacentlines among the j- and (j+1)-th data lines D_(j) and D_(j+1) and thefirst and second power supply connecting lines PCE1 and PCE2 may bedisposed in different layers.

Thus, if the j- and (j+1)-th data lines D_(j) and D_(j+1) are disposedin a different layer from the first and second power supply connectinglines PCE1 and PCE2, process error need not be considered, and as aresult, the distance between each pair of adjacent lines among the j-and (j+1)-th data lines D_(j) and D_(j+1) and the first and second powersupply connecting lines PCE1 and PCE2 may be smaller than the predefinedminimum distance.

According to the structure depicted in FIGS. 14 and 15, in a case wherein the wiring area LA, the j- and (j+1)-th data lines D_(j) and D_(j+1)are disposed in a different layer from the first and second power supplyconnecting lines PCE1 and PCE2, the distances between the j- and(j+1)-th data lines D_(j) and D_(j+1) and the first and second powersupply connecting lines PCE1 and PCE2 may become narrower when the j-and (j+1)-th data lines D_(j) and D_(j+1) and the first and second powersupply connecting lines PCE1 and PCE2 are all disposed in the samelayer. As a result, the light-transmitting area TA can be widened.

In the wiring area LA, the (k−1)-th scan line Sk−1 and the k-th emissionline Ek may be formed of the first gate metal layer GTL1. In the wiringarea LA, the (k−1)-th scan line Sk−1 and the k-th emission line Ek maybe disposed on the gate insulating film 130. In the wiring area LA, theinitialization voltage line VIL and the first scan connecting line SCE1may be formed of the second gate metal layer GTL2. In the wiring areaLA, the initialization voltage line VIL and the first scan connectingline SCE1 may be disposed on the first interlayer insulating film 141.For example, in the wiring area LA, the initialization voltage line VILand the first scan connecting line SCE1 may be disposed in a differentlayer from the (k−1)-th scan line Sk−1 and the k-th emission line Ek.

In a case where in the wiring area LA, the initialization voltage lineVIL, the (k−1)-th data line Sk−1, the first scan connecting line SCE1,and the k-th emission line Ek are disposed in the same layer, theinitialization voltage line VIL, the (k−1)-th data line Sk−1, the firstscan connecting line SCE1, and the k-th emission line Ek may beshort-circuited due to process error if the distance between each pairof adjacent lines among the initialization voltage line VIL, the(k−1)-th data line Sk−1, the first scan connecting line SCE1, and thek-th emission line Ek is smaller than a predetermined minimum distance.Thus, in a case where the initialization voltage line VIL, the (k−1)-thdata line Sk−1, the first scan connecting line SCE1, and the k-themission line Ek are disposed in the same layer, the initializationvoltage line VIL, the (k−1)-th data line Sk−1, the first scan connectingline SCE1, and the k-th emission line Ek may be formed at a distancegreater than the predefined minimum distance from one another inconsideration of process error.

In a case where in the wiring area LA, the (k−1)-th data line Sk−1 andthe k-th emission line Ek are disposed in a different layer from the(k−1)-th scan line Sk−1 and the first scan connecting line SCE1, eachpair of adjacent lines among the initialization voltage line VIL, the(k−1)-th data line Sk−1, the first scan connecting line SCE1, and thek-th emission line Ek may be disposed in different layers. Thus, if the(k−1)-th data line Sk−1 and the k-th emission line Ek are disposed in adifferent layer from the (k−1)-th scan line Sk−1 and the first scanconnecting line SCE1, process error need not be considered, and as aresult, the distance between each pair of adjacent lines among theinitialization voltage line VIL, the (k−1)-th data line Sk−1, the firstscan connecting line SCE1, and the k-th emission line Ek may be smallerthan the predefined minimum distance.

According to the structure depicted in FIGS. 14 and 15, in a case wherein the wiring area LA, the (k−1)-th data line Sk−1 and the k-th emissionline Ek are disposed in a different layer from the (k−1)-th scan lineSk−1 and the first scan connecting line SCE1, the distances between theinitialization voltage line VIL, the (k−1)-th data line Sk−1, the firstscan connecting line SCE1, and the k-th emission line Ek may becomenarrower when the initialization voltage line VIL, the (k−1)-th dataline Sk−1, the first scan connecting line SCE1, and the k-th emissionline Ek are all disposed in the same layer. As a result, thelight-transmitting area TA can be widened.

FIG. 16 is a plan view illustrating the area A of FIG. 5. FIG. 17 is across-sectional view taken along line VIII-VIII′ of FIG. 16.

The embodiment of FIGS. 16 and 17 differs from the embodiment of FIGS.14 and 15 in that the initialization voltage line VIL, the (k−1)-th scanline Sk−1, the j-th data line D_(j), and the first power supplyconnecting line PCE1 are disposed to at least partially overlap with oneanother in the thickness direction (e.g. the Z-axis direction), and thatthe k-th scan line Sk, the k-th emission line Ek, the (j+1)-th data lineD_(j+1), and the second power supply connecting line PCE2 are disposedto at least partially overlap with one another in the thicknessdirection (e.g. the Z-axis direction).

According to the embodiment of FIGS. 16 and 17, since in the wiring areaLA, the (k−1)-th scan line Sk−1 and the k-th emission line Ek aredisposed in a different layer from an initialization connecting line VEand the first scan connecting line SCE1, the initialization voltage lineVIL and the (k−1)-th scan line Sk−1, which are adjacent to each other,may be disposed to at least partially overlap with each other in thethickness direction, and the first scan connecting line SCE1 and thek-th emission line Ek, which are adjacent to each other, may be disposedto at least partially overlap with each other in the thicknessdirection. Also, since in the wiring area LA, the (j−1)- and j-th datalines D_(j+1) and D_(j) are disposed in a different layer from the firstand second power supply connecting lines PCE1 and PCE2, the j-th dataline D_(j) and the first power supply connecting line PCE1, which areadjacent to each other, may be disposed to at least partially overlapwith each other in the thickness direction, and the (j+1)-th data lineD_(j+1) and the second power supply connecting line PCE2, which areadjacent to each other, may be disposed to at least partially overlapwith each other in the thickness direction. Therefore, the width of thewiring area LA can be further reduced, as compared to the embodiment ofFIGS. 14 and 15, and as a result, the light-transmitting are TA can befurther widened.

FIG. 18 is a plan view illustrating the area A of FIG. 5. FIG. 19 is across-sectional view taken along line V-V′ of FIG. 18.

The embodiment of FIGS. 18 and 19 differs from the embodiment of FIGS.14 and 15 in that the initialization voltage line is connected to theinitialization connecting line VE, and that the initializationconnecting line VE and the first scan connecting line SCE1 are formed ofthe light-shielding layer BML. The embodiment of FIGS. 18 and 19 willhereinafter be described, focusing mainly on the differences with theembodiment of FIGS. 14 and 15. To the extent that details concerningvarious elements have been omitted herein, it may be assumed that thesedetails are at least similar to corresponding elements previouslydescribed.

Referring to FIGS. 18 and 19, in the wiring area LA, the initializationvoltage line VIL may be connected to the initialization connecting lineVE through a third connecting contact hole BCNT3. In the wiring area LA,the k-th scan line Sk may be connected to the first scan connecting lineSCE1 through a fourth connecting contact hole BCNT4.

In the wiring area LA, the j-th data line A, the first power supplyconnecting line PCE1, the (j+1)-th data line D_(j+1), and the secondpower supply connecting line PCE2 may at least partially overlap withthe initialization connecting line VE, instead of the initializationvoltage line VIL.

In the wiring area LA, the initialization connecting line VE and thefirst scan connecting line SCE1 may be formed of the light-shieldinglayer BML. In the wiring area LA, the initialization connecting line VEand the first scan connecting line SCE1 may be disposed on the bufferfilm BF. In the wiring area LA, the (k−1)-th scan line Sk−1 and the k-themission line Ek may be formed of the first gate metal layer GTL1. Inthe wiring area LA, the (k−1)-th scan line Sk−1 and the k-th emissionline Ek may be disposed on the gate insulating film 130.

The distance between the light-shielding layer BML and the first gatemetal layer GTL1 may be greater than the distance between the first andsecond gate metal layers GTL1 and GTL2. Thus, the influence of theinitialization connecting line VE and the first scan connecting lineSCE1, which are formed of the light-shielding layer BML, upon the(k−1)-th scan line Sk−1 and the k-th emission line Ek, which are formedof the first gate metal layer GTL1, and vice versa due to coupling canbe reduced.

In a case where in the wiring area LA, the (k−1)-th scan line Sk−1 andthe k-th emission line Ek are disposed in a different layer from theinitialization connecting line VE and the first scan connecting lineSCE1, each pair of adjacent lines among the initialization connectingline VE, the (k−1)-th scan line Sk−1, the first scan connecting lineSCE1, and the k-th emission line Ek may be disposed in different layers.Thus, if the (k−1)-th scan line Sk−1 and the k-th emission line Ek aredisposed in a different layer from the initialization connecting line VEand the first scan connecting line SCE1, process error need not beconsidered, and as a result, the distance between each pair of adjacentlines among the initialization connecting line VE, the (k−1)-th scanline Sk−1, the first scan connecting line SCE1, and the k-th emissionline Ek may be smaller than a predefined minimum distance.

According to the structures depicted in FIGS. 18 and 19, in a case wherein the wiring area LA, the (k−1)-th data line Sk−1 and the k-th emissionline Ek are disposed in a different layer from the (k−1)-th scan lineSk−1 and the first scan connecting line SCE1, the distances between theinitialization connecting line VE, the (k−1)-th scan line Sk−1, thefirst scan connecting line SCE1, and the k-th emission line Ek maybecome narrower when the initialization connecting line VE, the (k−1)-thscan line Sk−1, the first scan connecting line SCE1, and the k-themission line Ek are all disposed in the same layer. As a result, thelight-transmitting area TA can be widened.

In the structures depicted in FIGS. 18 and 19, the initializationconnecting line VE and the (k−1)-th scan line Sk−1, which are adjacentto each other, may be disposed to at least partially overlap with eachother in the thickness direction, and the first scan connecting lineSCE1 and the k-th emission line Ek, which are adjacent to each other,may be disposed to at least partially overlap with each other in thethickness direction. Also, the j-th data line D_(j) and the first powersupply connecting line PCE1, which are adjacent to each other, may bedisposed to at least partially overlap with each other in the thicknessdirection, and the (j+1)-th data line D_(j+1) and the second powersupply connecting line PCE2, which are adjacent to each other, may bedisposed to at least partially overlap with each other in the thicknessdirection. Therefore, the width of the wiring area LA can be furtherreduced, and as a result, the light-transmitting are TA can be furtherwidened.

FIG. 20 is a plan view illustrating the area A of FIG. 5. FIG. 21 is across-sectional view taken along line VI-VI′ of FIG. 20.

The embodiment of FIGS. 20 and 21 differs from the embodiment of FIGS.14 and 15 in that the (k−1)-th scan line Sk−1 is connected to a secondscan connecting line SCE2, and that the k-th emission line Ek isconnected to an emission connecting line ECE. The embodiment of FIGS. 20and 21 will hereinafter be described, focusing mainly on the differenceswith the embodiment of FIGS. 14 and 15. To the extent that detailsconcerning various elements have been omitted herein, it may be assumedthat these details are at least similar to corresponding elementspreviously described.

Referring to FIGS. 20 and 21, in the wiring area LA, the (k−1)-th scanline Sk−1 may be connected to the second scan connecting line SCE2through a fifth connecting contact hole BCNT5. In the wiring area LA,the k-th emission line Ek may be connected to the emission connectingline ECE through another fifth connecting contact hole BCNT5.

In the wiring area LA, the j-th data line D_(j), the first power supplyconnecting line PCE1, the (j+1)-th data line D_(j+1), and the secondpower supply connecting line PCE2 may at least partially overlap withthe second scan connecting line SCE2, instead of the (k−1)-th scan lineSk-1, and may at least partially overlap with the emission connectingline ECE, instead of the k-th emission line Ek.

In the wiring area LA, the second scan connecting line SCe2 and theemission connecting line ECE may be formed of the light-shielding layerBML. In the wiring area LA, the second scan connecting line SCE2 and theemission connecting line ECE may be disposed on the buffer film BF, Theinitialization voltage line VIL and the first scan connecting line SCE1may be formed of the second gate metal layer GTL2. In the wiring areaLA, the initialization voltage line VIL and the first scan connectingline SCE1 may be disposed on the first interlayer insulating film 141.

The distance between the light-shielding layer BML and the second gatemetal layer GTL2 may be greater than the distance between the first andsecond gate metal layers GTL1 and GTL2. Thus, the influence of thesecond scan connecting line SCE2 and the emission connecting line ECE,which are formed of the light-shielding layer BML, upon theinitialization voltage line VIL and the first scan connecting line SCE1,which are formed of the second gate metal layer GTL2, and vice versa dueto coupling can be reduced.

In a case where in the wiring area LA, the second scan connecting lineSCE2 and the emission connecting line ECE are disposed in a differentlayer from the initialization voltage line VIL and the first scanconnecting line SCE1, each pair of adjacent lines among theinitialization voltage line VIL, the first scan connecting line SCE1,the second scan connecting line SCE2, and the emission connecting lineECE may be disposed in different layers. Thus, if the second scanconnecting line SCE2 and the emission connecting line ECE are disposedin a different layer from the initialization voltage line VIL and thefirst scan connecting line SCE1, process error need not be considered,and as a result, the distance between each pair of adjacent lines amongthe initialization voltage line VIL, the first scan connecting lineSCE1, the second scan connecting line SCE2, and the emission connectingline ECE may be smaller than a predefined minimum distance.

According to the embodiment of FIGS. 20 and 21, in a case where in thewiring area LA, the second scan connecting line SCE2 and the emissionconnecting line ECE are disposed in a different layer from theinitialization voltage line VI L and the first scan connecting lineSCE1, the distances between the initialization voltage line VIL, thefirst scan connecting line SCE1, the second scan connecting line SCE2,and the emission connecting line ECE may become narrower than when theinitialization voltage line VIL, the first scan connecting line SCE1,the second scan connecting line SCE2, and the emission connecting lineECE are all disposed in the same layer. As a result, thelight-transmitting area TA can be widened.

In the embodiment of FIGS. 20 and 21, the initialization connecting lineVE and the second scan connecting line SCE2, which are adjacent to eachother, may be disposed to at least partially overlap with each other inthe thickness direction, and the first scan connecting line SCE1 and theemission connecting line ECE, which are adjacent to each other, may bedisposed to at least partially overlap with each other in the thicknessdirection. Also, the j-th data line D_(j) and the first power supplyconnecting line PCE1, which are adjacent to each other, may be disposedto at least partially overlap with each other in the thicknessdirection, and the (j+1)-th data line D_(j+1) and the second powersupply connecting line PCE2, which are adjacent to each other, may bedisposed to at least partially overlap with each other in the thicknessdirection. Therefore, the width of the wiring area LA can be furtherreduced, and as a result, the light-transmitting are TA can be furtherwidened.

FIG. 22 is a plan view illustrating pixels, the scan lines, the datalines, and the first driving voltage lines in the sensor area of thedisplay device of FIG. 1.

The embodiment of FIG. 22 differs from the embodiment of FIG. 5 in thatvoltage connecting lines VCE which are connected to the first drivingvoltage lines VDDL are additionally provided. The embodiment of FIG. 22will hereinafter be described, focusing mainly on the differences withthe embodiment of FIG. 5. To the extent that details concerning variouselements have been omitted herein, it may be assumed that these detailsare at least similar to corresponding elements previously described.

Referring to FIG. 22, the voltage connecting lines VCE may extendprimarily in the first direction (e.g. the X-axis direction), and thefirst driving voltage lines VDDL may extend primarily in the seconddirection (e.g. the Y-axis direction). The voltage connecting lines VCEmay be disposed in the wiring area LA, and the first driving voltagelines VDDL may be disposed in the pixel area PA and in the wiring areaLA. In the pixel area PA, the first driving voltage lines VDDL may beconnected to the voltage connecting lines VCE.

Since the voltage connecting lines VCE extend primarily in the firstdirection (e.g. the X-axis direction), one of the voltage connectinglines VCE may be disposed on one side of the light-transmitting area TA,e.g., on the upper side of the light-transmitting area TA, and anotherone of the voltage connecting lines VCE may be disposed on the otherside of the light-transmitting area TA, e.g., on the lower side of thelight-transmitting area TA.

According to the embodiment of FIG. 22, due to the presence of thevoltage connecting lines VCE, the first driving voltage lines VDDL,which are disposed in the pixel area PA, on the upper side of thelight-transmitting area TA, do not need to be connected to the firstdriving voltage lines VDDL, which are disposed in the pixel are PA, onthe lower side of the light-transmitting area TA. Thus, the firstdriving voltage lines VDDL may be omitted from the wiring area LA. Thus,the arrangement of wires in the wiring area LA can be simplified.

Second voltage connecting lines which are connected to theinitialization voltage lines VIL may be additionally provided, in whichcase, the second voltage connecting lines may extend primarily in thesecond direction (e.g. the Y-axis direction) since the initializationvoltage lines VIL extend primarily in the first direction (e.g. theX-axis direction).

FIG. 23 is a plan view illustrating an area B of FIG. 22. FIG. 24 is across-sectional view taken along line VII-VII′ of FIG. 23.

The embodiment of FIGS. 23 and 24 differs from the embodiment of FIGS.14 and 15 in that a voltage connecting line VCE which is connected tothe first driving voltage lines VDDL is additionally provided, and thatthe first and second power supply connecting lines PCE1 and PCE2 are notprovided. To the extent that details concerning various elements havebeen omitted herein, it may be assumed that these details are at leastsimilar to corresponding elements previously described.

Referring to FIGS. 23 and 24, the voltage connecting line VCE may beconnected to a plurality of first driving voltage lines VDDL in thepixel area PA. For example, a plurality of first driving voltage linesVDDL at least partially overlapping with first subpixels SP1 that areadjacent to one another in the first direction (e.g. the X-axisdirection) may be connected to a single voltage connecting line VCE.

The voltage connecting line VCE may be disposed in a different layerfrom the first driving voltage lines VDDL. In this case, the voltageconnecting line VCE may be connected to the first driving voltage linesVDDL through sixth connecting contact holes BCNT6. For example, thevoltage connecting line VCE may be formed of the second source metallayer DTL2 and may be disposed on the first planarization film 160, asillustrated in FIG. 24, but the present disclosure is not limitedthereto. In another example, the voltage connecting line VCE may beformed of the first gate metal layer GTL1 and may be disposed on thegate insulating film 130. In yet another example, the voltage connectingline VCE may be formed of the second gate metal layer GTL2 and may bedisposed on the first interlayer insulating film 141.

Alternatively, the voltage connecting line VCE may be disposed in thesame layer as the first driving voltage lines VDDL. In this case, thevoltage connecting line VCE may be connected to the first drivingvoltage lines VDDL without the need of contact holes. In order for thevoltage connecting line VCE to be disposed in the same layer as thefirst driving voltage lines VDDL, the j- and (j+1)-th data lines D_(j)and D_(j+1) may be connected to data connecting electrodes in the pixelarea PA. The data connecting electrodes may be formed in the same layeras the first driving voltage lines VDDL and may be disposed on the firstplanarization film 160.

In the embodiment of FIGS. 23 and 24, the initialization line VIL andthe (k−1)-th scan line Sk−1, which are adjacent to each other, may bedisposed to at least partially overlap with each other in the thicknessdirection, and the first scan connecting line SCE1 and the k-th emissionline Ek, which are adjacent to each other, may be disposed to at leastpartially overlap with each other in the thickness direction. In thiscase, the width of the wiring area LA can be further reduced, and as aresult, the light-transmitting area TA can be further widened.

According to the aforementioned and other embodiments of the presentdisclosure, since a sensor area of a display panel of a display deviceincludes a light-transmitting area that transmits light therethrough,light can be incident from the top surface of the display device uponsensor devices, which are disposed on the bottom surface of the displaypanel, through the light-transmitting area, even if the sensor devicesare disposed to overlap with the sensor area in the thickness directionof the display panel. Accordingly, the degradation of the sensingcapabilities of the sensor devices can be prevented or reduced.

In addition, since six transistors are not provided in first subpixels,a wiring area can be provided in regions where the sixth transistors arenot provided, and as a result, a light-transmitting area can be widened.

Moreover, the distance between adjacent wires can become narrower whenthe adjacent wires are disposed in different layers in the wiring areathan when the adjacent wires are disposed in the same layer in thewiring area, and as a result, the light-transmitting area can bewidened.

Furthermore, since first driving voltage lines are connected to avoltage connecting line, first driving voltage lines on one side of thelight-transmitting area do not need to be connected, via the wiringarea, to first driving voltage lines on the other side of thelight-transmitting area. Thus, since the first driving voltage lines arenot provided in the wiring area, the arrangement of wires in the wiringarea can be simplified.

While the present invention has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be apparent tothose of ordinary skill in the art that various changes in form anddetail may be made thereto without departing from the spirit and scopeof the present invention as defined by the following claims.

What is claimed is:
 1. A display device, comprising: a display panelincluding a main area and a sensor area; and a plurality of sensordevices at least partially overlapping the sensor area of the displaypanel in a thickness direction of the display panel, wherein the displaypanel includes a plurality of first subpixels disposed in the sensorarea and a plurality of second subpixels disposed in the main area, andwherein the number of transistors of each of the plurality of firstsubpixels is different from the number of transistors of each of theplurality of second subpixels.
 2. The display device of claim 1, whereinthe number of transistors of each of the plurality of first subpixels issmaller than the number of transistors of each of the plurality ofsecond subpixels.
 3. The display device of claim 2, wherein the displaypanel further includes scan lines, data lines, and emission lines, andthe first plurality of subpixels and the second plurality of subpixelseach include: a driving transistor controlling a driving current thatflows from a first electrode to a second electrode of the drivingtransistor, in accordance with a data voltage applied to a gateelectrode of the driving current; a light-emitting element connected tothe second electrode of the driving transistor, a first transistor thatis turned on by a scan signal from one of the scan lines so as toconnect the gate electrode of the driving transistor and aninitialization voltage line to which an initialization voltage isapplied; a second transistor that is turned on by a scan signal fromanother one of the scan lines so as to connect the first electrode ofthe driving transistor and one of the data lines; a third transistorthat is turned on by a scan signal from yet another one of the scanlines so as to connect the first and second electrodes of the drivingtransistor; a fourth transistor that is turned on by an emission signalfrom one of the emission signals so as to connect the first electrode ofthe driving transistor and a first driving voltage line to which a firstdriving voltage is applied; and a fifth transistor that is turned on byan emission signal from another one of the emission lines so as toconnect the second electrode of the driving transistor and thelight-emitting element.
 4. The display device of claim 3, wherein eachof the second subpixels further includes a sixth transistor that isturned on by a scan signal from yet still another one of the scan linesso as to connect a first electrode of the light-emitting element and theinitialization voltage line.
 5. The display device of claim 1, whereinthe display panel further includes scan lines which at least partiallyoverlap with the first subpixels and the second subpixels and to whichscan signals are applied, and the number of scan lines at leastpartially overlapping with each of the first subpixels is different fromthe number of scan lines at least partially overlapping with each of thesecond subpixels.
 6. The display device of claim 5, wherein the numberof scan lines at least partially overlapping with each of the firstsubpixels is smaller than the number of scan lines at least partiallyoverlapping with each of the second subpixels.
 7. The display device ofclaim 6, wherein the display panel further includes a light-transmittingarea disposed in the sensor area, the light transmitting area notoverlapping with the first subpixels.
 8. The display device of claim 7,wherein the light-transmitting area is at least partially surrounded bythe first subpixels.
 9. The display device of claim 7, wherein thedisplay panel further includes a first scan connecting line connected toone of the scan lines in a wiring area between the light-transmittingarea and the first subpixels, and wherein the first scan connecting lineis disposed in a different layer from the scan lines.
 10. The displaydevice of claim 9, wherein the display panel further includes aninsulating film disposed between the first scan connecting line and thescan line to which the first scan connecting line is connected, and thefirst scan connecting line is connected to the scan line that it isconnected, through a contact hole which penetrates the insulating film.11. The display device of claim 9, wherein the display panel furtherincludes initialization voltage lines which at least partially overlapwith the first subpixels and the second subpixels and to whichinitialization voltages are applied, data lines which at least partiallyoverlap with the first subpixels and the second subpixels and to whichdata voltages are applied, and first driving voltage lines which atleast partially overlap with the first subpixels and the secondsubpixels and to which first driving voltages are applied.
 12. Thedisplay device of claim 11, wherein the display panel further includes apower supply connecting line connected to one of the first drivingvoltage lines in the wiring area and is disposed in a different layerfrom the first driving voltage lines.
 13. The display device of claim11, wherein one of the data lines at least partially overlaps with oneof the initialization voltage lines or the first scan connecting line inthe wiring area.
 14. The display device of claim 12, wherein the powersupply connecting line at least partially overlaps with one of the scanlines.
 15. The display device of claim 12, wherein the display panelfurther includes an insulating film disposed between the power supplyconnecting line and one of the first driving voltage lines, and thepower supply connecting line is connected to the first driving voltageline that it is connected, through a contact hole which penetrates theinsulating film.
 16. The display device of claim 12, wherein the powersupply connecting line is disposed on the data lines and on the firstdriving voltage lines, the data lines and the first driving voltagelines are disposed between the initialization voltage lines and thefirst scan connecting line, and the initialization voltage lines and thefirst scan connecting line are disposed on the scan lines.
 17. Thedisplay device of claim 12, wherein the display panel further includesan initialization connecting line connected to one of the initializationvoltage lines, and wherein the initialization connection line isdisposed in a different layer from the initialization voltage lines. 18.The display device of claim 17, wherein one of the data lines at leastpartially overlaps with the initialization connecting line or the firstscan connecting line in the wiring area.
 19. The display device of claim17, wherein the display panel further includes an insulating filmdisposed between the initialization connecting line and one of theinitialization voltage lines, and the initialization connecting line isconnected to the initialization voltage line that it is connected,through a contact hole which penetrates the insulating film.
 20. Thedisplay device of claim 17, wherein the power supply connecting line isdisposed on the data lines and on the first driving voltage lines, thedata lines and the first driving voltage lines are disposed on the scanlines, and the scan lines are disposed on the initialization connectingline and on the first scan connecting line.
 21. The display device ofclaim 12, wherein the display panel further includes a second scanconnecting line connected to another one of the scan lines and isdisposed in a different layer from the scan lines, emission lines whichat least partially overlap with the first subpixels and the secondsubpixels and to which emission signals are applied, and an emissionconnecting line connected to one of the emission lines and is disposedin a different layer from the emission lines.
 22. The display device ofclaim 21, wherein in the wiring area, one of the data lines at leastpartially overlaps with the second scan connecting line, and another oneof the data lines at least partially overlaps with the emissionconnecting line.
 23. The display device of claim 21, wherein the secondscan connecting line and the emission connecting line are disposed inthe same layer.
 24. The display device of claim 21, wherein the powersupply connecting line is disposed on the data lines and on the firstdriving voltage lines, the data lines and the first driving voltagelines are disposed on the initialization voltage lines and the firstscan connecting line, the initialization voltage lines and the firstscan connecting line are disposed on the scan lines and on the emissionlines, and the scan lines and the emission lines are disposed on thesecond scan connecting line and on the emission connecting line.
 25. Thedisplay device of claim 11, wherein the display panel further includes avoltage connecting line connected to the first driving voltage lines.26. The display device of claim 25, wherein the first driving voltagelines extend primarily in a first direction, and the voltage connectingline extends primarily in a second direction.
 27. The display device ofclaim 25, wherein the voltage connecting line is disposed on the firstdriving voltage lines.
 28. The display device of claim 25, wherein thefirst driving voltage lines are disposed on the voltage connecting line.29. The display device of claim 28, wherein the voltage connecting lineis disposed in the same layer as the initialization voltage lines and isdisposed on the scan lines.
 30. The display device of claim 28, whereinthe initialization voltage lines are disposed on the voltage connectingline and are disposed in the same layer as the scan lines.
 31. Thedisplay device of claim 25, wherein the first driving voltage lines aredisposed in the same layer as the voltage connecting line.
 32. A displaydevice, comprising: a display panel including a main area and a sensorarea; and sensor devices at least partially overlapping with the sensorarea of the display panel in a thickness direction of the display panel,wherein the display panel includes a plurality of first subpixels whichare disposed in the sensor area, a plurality of second subpixels whichare disposed in the main area, first driving voltage lines which atleast partially overlap with the plurality of first subpixels and theplurality of second subpixels and to which first driving voltages areapplied, and a power supply connecting line connected to the firstdriving voltage lines, and wherein the power supply connecting line isdisposed in a different layer from the first driving voltage lines. 33.A display device, comprising: a light-transmitting area; a plurality ofsubpixels at least partially surrounding the light-transmitting area;first conductive lines connected to the plurality of subpixels; andsecond conductive lines connected to the first conductive lines in awiring area between the light-transmitting area and the subpixels,wherein the first conductive lines are disposed in a different layerfrom the second conductive lines.